Results 271 to 280 of about 44,408 (304)
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Demystifying the Influence of Channel Components on Signal Integrity (SI) Margin
2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility and International Conference on ElectroMagnetic Interference & Compatibility (APEMC/INCEMIC), 2023Sanjay Kumar +8 more
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Bioelectrochemistry
Cardiac troponin I (cTnI) is known to be among the prominent diagnostic bio-marker for acute myocardial infarction (AMI). In this paper, we proposed an electrochemical aptasensor with nanomaterial MoS2/CuS-Au as the substrate material and perillaldehyde (PA) as the surface-initiated reversible addition fragmentation chain transfer (SI-RAFT ...
Yuning, Zhao +8 more
openaire +2 more sources
Cardiac troponin I (cTnI) is known to be among the prominent diagnostic bio-marker for acute myocardial infarction (AMI). In this paper, we proposed an electrochemical aptasensor with nanomaterial MoS2/CuS-Au as the substrate material and perillaldehyde (PA) as the surface-initiated reversible addition fragmentation chain transfer (SI-RAFT ...
Yuning, Zhao +8 more
openaire +2 more sources
2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2017
This paper presents low-power double data rate 5 (LPDDR5) power plane stitching impedance impact to radio frequency interference (RFI) and Signal Integrity (SI). LPDDR5 power plane split causes RFI and SI degradation, but can be mitigated through appropriate power plane stitching impedance.
Ying-Ern Ho +3 more
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This paper presents low-power double data rate 5 (LPDDR5) power plane stitching impedance impact to radio frequency interference (RFI) and Signal Integrity (SI). LPDDR5 power plane split causes RFI and SI degradation, but can be mitigated through appropriate power plane stitching impedance.
Ying-Ern Ho +3 more
openaire +1 more source
2011 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 2011
We present recent results on the direct heterogeneous integration of InP HBTs and Si CMOS on a silicon template wafer or SOLES (Silicon On Lattice Engineered Substrate). InP HBTs whose performance are comparable to HBTs on the native InP substrates have been repeatedly achieved.
T. E. Kazior +5 more
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We present recent results on the direct heterogeneous integration of InP HBTs and Si CMOS on a silicon template wafer or SOLES (Silicon On Lattice Engineered Substrate). InP HBTs whose performance are comparable to HBTs on the native InP substrates have been repeatedly achieved.
T. E. Kazior +5 more
openaire +1 more source
Signal integrity and power integrity
IEEE Electromagnetic Compatibility Magazine, 2020En-Xiao Liu
exaly
INTER-CHIP SIGNAL TRANSMISSION USING SI INTEGRATED ANTENNA
IEICE Proceeding Series, 2004openaire +1 more source
Wavelet-Based Approach to Evaluation of Signal Integrity
IEEE Transactions on Industrial Electronics, 2013Josep Balcells, Javier Gago
exaly