Results 181 to 190 of about 70,198,860 (309)

Photoluminescence Reshaping via Structural Confinement and Local Density of Optical States Control in Ir(III)‐Doped Biodegradable Metasurfaces

Advanced Materials Technologies, EarlyView.
Phosphorescent biodegradable metasurface showing vibronic selection and spectral photoluminescence narrowing. Anti‐correlation between experimental LDOS and measured lifetimes. ABSTRACT Metasurfaces incorporating phosphorescent emitters offer a route to engineer radiative and vibronic processes beyond chemical design.
Vincenzo Caligiuri, Andrea Smeriglio, Svetlana Siprova, Olga Favale, Francesca Leone, Roberto Termine, Debora Policastro, Alessandra Crispini, Attilio Golemme, Nicolas Godbert, Iolinda Aiello, Antonio De Luca   +11 more
wiley   +1 more source

Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process. [PDF]

Microsyst Nanoeng
Li Y, Bleiker SJ, Worsey E, Dagon M, Edinger P, Takabayashi AY, Quack N, Verheyen P, Bogaerts W, Gylfason KB, Pamunuwa D, Niklaus F.   +11 more
europepmc   +1 more source

TRANSMISSION ELECTRON-MICROSCOPY STUDY OF N+-IMPLANTED SILICON ON INSULATOR BY ENERGY-FILTERED IMAGING

, 1991
We report on the first study of N+ -implanted silicon on insulator by energy-filtered imaging using an Opton electron microscope CEM 902 equipped Castaing-Henry electron optical system as a spectrometer.
DU AY, CHU YM, DUAN XF, DUAN XF ACAD SINICABEIJING LAB ELECTRON MICROSCOPYPOB 2724BEIJING 100080PEOPLES R CHINA   +3 more
core  

Recent Advances in Transparent Microelectrode Device Architecture and Fabrication Strategies for Biomedical Applications

Advanced Materials Technologies, EarlyView.
Transparent microelectrode arrays enable simultaneous optical and electrical electrophysiology with high spatiotemporal resolution, allowing multimodal observations of dynamic biological systems. Advances in materials and device architectures improve device performance by addressing key trade‐offs between optical transparency, impedance, and ...
Michael Abraham Listyawan, Tran Bach Dang, Chi Cong Nguyen, Yee Lap Pong, Tianruo Guo, Thanh Nho Do, Hoang‐Phuong Phan   +6 more
wiley   +1 more source

High Sensitivity Design for Silicon-On-Insulator-Based Asymmetric Loop-Terminated Mach-Zehnder Interferometer. [PDF]

Materials (Basel)
Butt MA.
europepmc   +1 more source

One-Stage Formation of Two-Dimensional Photonic Crystal and Spatially Ordered Arrays of Self-Assembled Ge(Si) Nanoislandson Pit-Patterned Silicon-On-Insulator Substrate. [PDF]

Nanomaterials (Basel), 2021
Novikov AV, Smagina ZV, Stepikhova MV, Zinovyev VA, Rudin SA, Dyakov SA, Rodyakina EE, Nenashev AV, Sergeev SM, Peretokin AV, Dvurechenskii AV.   +10 more
europepmc   +1 more source

Spatially Configurable Conformal Sensor Integration on an Ultra‐Fine Metallic Needle for Minimally Invasive Deep‐Tissue Oxygen Monitoring

Advanced Materials Technologies, EarlyView.
A multi‐point oxygen‐sensing ultra‐fine needle (MO‐UFN) is developed by conformally integrating a lithographically patterned flexible electrochemical sensor array onto a clinical acupuncture needle. The platform preserves an approximately 0.3 mm diameter while enabling spatially resolved oxygen profiling along the insertion pathway.
Yeju Seo, Jaeho Park, Yongrok Jeong, Ji‐Hwan Ha, Junseong Ahn, Jimin Gu, Su A Park, Ilwoo Jun, Kichul Lee, Inkyu Park   +9 more
wiley   +1 more source

Silicon-on-Insulator (SOI) Lateral Power-Reduced Surface Field FinFET with High-Power Figure of Merit of 239.3 MW/cm². [PDF]

Micromachines (Basel)
Song CW, Lee T, Kim D, Kyoung S, Woo S.
europepmc   +1 more source

Silicon-on-insulator based 2 x 2 multimode interference coupler with large tolerance

, 2001
We demonstrate a type of 2 x 2 multimode interference 3 dB coupler based on silicon-on-insulator. The fabrication tolerance was investigated by the effective index method and the guide mode method.
Wei HZ, Liu ZL, Zhang XF, Shi W, Fang CS, Wei HZ,Chinese Acad Sci,State Key Lab Integrated Optoelect,Beijing 100083,Peoples R China., Yu JZ   +6 more
core  

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

Advanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju, Rumana Hossain, Veena Sahajwalla   +2 more
wiley   +1 more source