Results 61 to 70 of about 682,894 (319)

Phase Field Failure Modeling: Brittle‐Ductile Dual‐Phase Microstructures under Compressive Loading

open access: yesAdvanced Engineering Materials, EarlyView.
The approach by Amor and the approach by Miehe and Zhang for asymmetric damage behavior in the phase field method for fracture are compared regarding their fitness for microcrack‐based failure modeling. The comparison is performed for the case of a dual‐phase microstructure with a brittle and a ductile constituent.
Jakob Huber, Jan Torgersen, Ewald Werner
wiley   +1 more source

Modelling of Evanescent Field Scattering

open access: yesProceedings, 2020
Evanescent field particle scattering is a promising method for single particle detection. In this study, we performed a detailed numerical analysis to show the possibilities and limitations of analytical models for predicting the capabilities of this ...
Andreas Tortschanoff   +2 more
doaj   +1 more source

Porous, multi-layered piezoelectric composites based on highly oriented PZT/PVDF electrospinning fibers for high-performance piezoelectric nanogenerators

open access: yesJournal of Advanced Ceramics, 2022
Piezoelectric nanogenerators (PENGs) that can harvest mechanical energy from ambient environment have broad prospects for multi-functional applications. Here, multi-layered piezoelectric composites with a porous structure based on highly oriented Pb(Zr0 ...
Xiangxin Du   +5 more
doaj   +1 more source

Karl Popper and the Mechanisms of Hydrogen Embrittlement

open access: yesAdvanced Engineering Materials, EarlyView.
Representation of the beginning of loss of ductility rather than embrittlement. Small concentrations of hydrogen in a diffusible form within iron are well‐established to harm the mechanical integrity of steels. There are theories that attempt to explain the pernicious role of hydrogen.
H. K. D. H. Bhadeshia
wiley   +1 more source

Development of an original model for the synthesis of silicon nanodots by Low Pressure Chemical Vapor Deposition [PDF]

open access: yes, 2008
Using the Computational Fluid Dynamics code Fluent, a simulation model of an industrial Low Pressure Chemical Vapor Deposition reactor has been developed for the synthesis of silicon nanodots from silane SiH4 on silicon dioxide SiO2 substrates.
Billon, Thierry   +4 more
core   +1 more source

Magnetic Field Sensors for Non-Invasive Current Monitoring in Wire-Bond-Less Power Modules

open access: yesProceedings
A non-invasive implementation of a planar magnetoresistive sensor on top of copper interconnected power modules is proposed. This solution allows for the real-time monitoring of the electrical current flowing across the power modules.
Perla Malagò   +4 more
doaj   +1 more source

Improved explosion resistance of low cement refractory castables using drying agents

open access: yesInternational Journal of Ceramic Engineering & Science, 2022
Low cement castables (LCCs) containing different types of drying agents (polymer fibers and EMSIL‐DRY™) have been studied both in laboratory‐ and industrial‐scale.
Hong Peng, Bjørn Myhre
doaj   +1 more source

Hydrogen‐Assisted Fracture of Iron‐Based Fe–Ni–Al Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
Principal relations and fracture mechanisms of single‐phase and precipitate‐strengthened Fe–Ni–Al alloys subjected to prior electrochemical hydrogen charging are identified. The mechanisms of hydrogen effect on strength and microhardness are discussed, including hydrogen‐induced increase in microhardness and the role of hydrogen in fracture behavior ...
Nataliya Yadzhak   +3 more
wiley   +1 more source

Bottom-up approach to silicon nanoelectronics [PDF]

open access: yes, 2005
103-108Silicon, nanoelectronics, nanodotsThis paper presents a brief review of our recent work investigating a novel bottom-up approach to realize silicon based nanoelectronics.
Mizuta, Hiroshi, Mizuta, H., Oda, S.
core  

Flexible, Fan-Out, Wafer-Level Packaging Using Polydimethylsiloxane and Printed Redistribution Layers

open access: yesProceedings
The hybrid integration of electronics in flexible substrates using fanned-out, wafer-level packaging (FOWLP) has recently gained significant attention, with numerous applications in wearable electronics, foldable displays, robotics, medical implants, and
Muhammad Hassan Malik   +3 more
doaj   +1 more source

Home - About - Disclaimer - Privacy