Results 61 to 70 of about 1,443,984 (310)

Increased voltage photovoltaic cell [PDF]

open access: yes, 1985
A photovoltaic cell, such as a solar cell, is provided which has a higher output voltage than prior cells. The improved cell includes a substrate of doped silicon, a first layer of silicon disposed on the substrate and having opposite doping, and a ...
Bickler, D. B.   +2 more
core   +1 more source

Influence of Sample Preparation and Processing Procedures on the Thermal Diffusivity of MgO‐C Refractories

open access: yesAdvanced Engineering Materials, EarlyView.
The thermal diffusivity of MgO‐C refractories is highly sensitive to sample preparation and processing procedures. In this article, the effects of coking sequence, machining conditions, structural inhomogeneity, and graphite coating application on measurements using laser flash apparatus are systematically investigated.
Luyao Pan   +4 more
wiley   +1 more source

Simulation of High Conversion Efficiency and Open-circuit Voltages Of {\alpha}-si/poly-silicon Solar Cell

open access: yes, 2011
The P+ {\alpha}-Si /N+ polycrystalline solar cell is molded using the AMPS-1D device simulator to explore the new high efficiency thin film poly-silicon solar cell.
A. Madan   +18 more
core   +1 more source

EBSD Study of Creep‐Induced Lattice Misorientation in MgO‐Particle‐Reinforced Austenitic Steel Composites

open access: yesAdvanced Engineering Materials, EarlyView.
Creep experiments at 900°C on coarse‐grained steel‐ceramic composites containing recycled magnesia reveal that higher ceramic volume fractions significantly enhance the creep resistance. Detailed EBSD investigations identify subgrain formation in the steel matrix as the dominant deformation mechanism.
Moritz Müller   +6 more
wiley   +1 more source

Modelling of Evanescent Field Scattering

open access: yesProceedings, 2020
Evanescent field particle scattering is a promising method for single particle detection. In this study, we performed a detailed numerical analysis to show the possibilities and limitations of analytical models for predicting the capabilities of this ...
Andreas Tortschanoff   +2 more
doaj   +1 more source

Porous, multi-layered piezoelectric composites based on highly oriented PZT/PVDF electrospinning fibers for high-performance piezoelectric nanogenerators

open access: yesJournal of Advanced Ceramics, 2022
Piezoelectric nanogenerators (PENGs) that can harvest mechanical energy from ambient environment have broad prospects for multi-functional applications. Here, multi-layered piezoelectric composites with a porous structure based on highly oriented Pb(Zr0 ...
Xiangxin Du   +5 more
doaj   +1 more source

Shielding method for polycrystalline and epitaxy growths [PDF]

open access: yes, 1971
Technique prevents silicon wafers from adhering to susceptor following silicon epitaxial deposition. Annular ring of refractory material goes around wafer during epitaxial deposit. Silicon is deposited on ring, susceptor, and portions of wafer.
Bue, J. L.
core   +1 more source

Light Emission in Silicon from Carbon Nanotubes

open access: yes, 2012
The use of optics in microelectronic circuits to overcome the limitation of metallic interconnects is more and more considered as a viable solution. Among future silicon compatible materials, carbon nanotubes are promising candidates thanks to their ...
Beck, Alexandre   +6 more
core   +2 more sources

Mid-IR heterogeneous silicon photonics [PDF]

open access: yes, 2014
In this paper we discuss silicon-based photonic integrated circuit technology for applications beyond the telecommunication wavelength range. Silicon-on-insulator and germanium-on-silicon passive waveguide circuits are described, as well as the ...
Baets, Roel   +29 more
core   +1 more source

Silicon Microrefrigerator [PDF]

open access: yesIEEE Transactions on Components and Packaging Technologies, 2006
We fabricated a silicon microrefrigerator on a 500-mu m-thick substrate with the standard integrated circuit (IC) fabrication process. The cooler achieves a maximum cooling of 1 degrees C below ambient at room temperature. Simulations show that the cooling power density for a 40 x 40 mu m(2) device exceeds 500 W/cm(2). The unique three-dimensional (3-D)
Zhang, Y, Zeng, G H, Shakouri, A
openaire   +2 more sources

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