Results 51 to 60 of about 2,165,490 (292)
Design of a full SiC three-phase power factor correction with an interleaved output buck converter
Active rectification of the three-phase grid nowadays is a central task of power electronics. However, as the necessary DC bus voltages vary, DC-DC converters are needed.
Maximilian Nitzsche +3 more
doaj +1 more source
Deep‐UV (258 nm) femtosecond pulses enable uniform amorphous silicon writing on Si(100)/(111) with a six‐fold larger fluence amorphization window than NIR methods. Optimized fluence and overlap yield 20–45 nm uniform and continuous amorphous layers. Microscopy shows sharp interfaces, and real‐time reflectivity reveals nanosecond melt–resolidification ...
Wissal Benali +5 more
wiley +1 more source
Optimised design consideration of suspension choppers in Maglev train using SiC MOSFET modules
Electromagnetic suspension (EMS) Maglev trains attracted to suspend above a track is a green type of track transportation. The suspension control box adopting a closed-loop feedback controller outputs a levitation current that flows into the ...
Xiaoyu Chen +5 more
doaj +1 more source
Can low-valent silicon compounds be better transition metal ligands than phosphines and NHCs?† [PDF]
We investigated the potential application of experimentally characterized low-valent silicon compounds as transition metal ligands by computing the most important ligand properties, σ-donor and π-acceptor ability, ligand-to-metal charge transfer, and ...
Zsolt Benedek, Tibor Szilvási
doaj +1 more source
Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley +1 more source
In this study, a three-dimensional model with multi-parameter order reduction is applied to the thermal modelling of power electronics modules with complex geometries.
Xiaojun Dong +2 more
doaj +1 more source
Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy
Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang +6 more
wiley +1 more source
Sub-assembly experiments to determine PWM supply-induced losses in electric machines
This paper presents a low-cost approach to experimentally characterise the effect of the inverter supply on the losses in an electrical machine. The set-up comprises of representative subassemblies of the stator and winding, referred to as ‘motorettes ...
Jonathan Godbehere +4 more
doaj +1 more source
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan +4 more
wiley +1 more source
Evaluating suitable semiconducting materials for cryogenic power electronics
The interest in hybrid electric aircraft has invigorated research into superconducting power networks and superconducting electrical machines. Underpinning this is the ability to control the flow of electrical current at cryogenic temperatures, using ...
Luke Bradley +4 more
doaj +1 more source

