A Time Mode Pulse Interleaver in a Silicon-on-Insulator Platform for Optical Analog-to-Digital Converters. [PDF]
Tu D+9 more
europepmc +1 more source
Theoretical Investigation of Near-Infrared Fabry-Pérot Microcavity Graphene/Silicon Schottky Photodetectors Based on Double Silicon on Insulator Substrates. [PDF]
Casalino M.
europepmc +1 more source
Van Der Waals Hybrid Integration of 2D Semimetals for Broadband Photodetection
Advanced broadband photodetector technologies are essential for military and civilian applications. 2D semimetals, with their gapless band structures, high mobility, and topological protection, offer great promise for broadband PDs. This study reviews the latest advancements in broadband PDs utilizing heterostructures that combine 2D semimetals with ...
Xue Li+9 more
wiley +1 more source
A High-Efficiency Wideband Grating Coupler Based on Si3N4 and a Silicon-on-Insulator Heterogeneous Integration Platform. [PDF]
Liu M, Zheng X, Zheng X, Gong Z.
europepmc +1 more source
Fabrication of wide-IF 200–300GHz superconductor–insulator–superconductor mixers with suspended metal beam leads formed on silicon-on-insulator [PDF]
Anupama B. Kaul+5 more
openalex +1 more source
Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics
Instead of using chemical cross–linkers, it is shown that PEDOT:PSS thin films for bioelectronics become water‐stable after a simple heat treatment. The heat treatment is compatible with a range of rigid and elastomeric substrates and films are stable in vivo for >20 days.
Siddharth Doshi+16 more
wiley +1 more source
This article summarizes significant technological advancements in materials, photonic devices, and bio‐interfaced systems, which demonstrate successful applications for impacting human healthcare via improved therapies, advanced diagnostics, and on‐skin health monitoring.
Seunghyeb Ban+5 more
wiley +1 more source
Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa+9 more
wiley +1 more source