Results 251 to 260 of about 2,146,457 (416)

A Time Mode Pulse Interleaver in a Silicon-on-Insulator Platform for Optical Analog-to-Digital Converters. [PDF]

open access: yesMicromachines (Basel)
Tu D   +9 more
europepmc   +1 more source

Van Der Waals Hybrid Integration of 2D Semimetals for Broadband Photodetection

open access: yesAdvanced Materials, EarlyView.
Advanced broadband photodetector technologies are essential for military and civilian applications. 2D semimetals, with their gapless band structures, high mobility, and topological protection, offer great promise for broadband PDs. This study reviews the latest advancements in broadband PDs utilizing heterostructures that combine 2D semimetals with ...
Xue Li   +9 more
wiley   +1 more source

Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics

open access: yesAdvanced Materials, Volume 37, Issue 13, April 2, 2025.
Instead of using chemical cross–linkers, it is shown that PEDOT:PSS thin films for bioelectronics become water‐stable after a simple heat treatment. The heat treatment is compatible with a range of rigid and elastomeric substrates and films are stable in vivo for >20 days.
Siddharth Doshi   +16 more
wiley   +1 more source

Photonic biosensors in silicon-on-insulator [PDF]

open access: yes, 2010
Baets, Roel   +5 more
core  

Advances in Photonic Materials and Integrated Devices for Smart and Digital Healthcare: Bridging the Gap Between Materials and Systems

open access: yesAdvanced Materials, EarlyView.
This article summarizes significant technological advancements in materials, photonic devices, and bio‐interfaced systems, which demonstrate successful applications for impacting human healthcare via improved therapies, advanced diagnostics, and on‐skin health monitoring.
Seunghyeb Ban   +5 more
wiley   +1 more source

Microring resonators in silicon-on-insulator [PDF]

open access: yes, 2005
Baets, Roel   +7 more
core  

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

open access: yesAdvanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa   +9 more
wiley   +1 more source

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