Results 101 to 110 of about 54,444 (308)

Conformal Metallosaccharide Hybrid Films for Protecting Wood Surfaces From Environmental Damage

Advanced Functional Materials, EarlyView.
Ti‐ribose hybrid films fabricated by molecular layer deposition form a conformal and uniform coating on wood surfaces, which provides water repellence, dimensional stability, and resistance to acidic and alkaline environments, while preserving the natural appearance.
Wenwen Wang, Aranzazu Sierra Fernandez, Gabriele Botta, Evgenii Modin, Iva Šarić Janković, Shidong Ji, Junli Liu, Mato Knez   +7 more
wiley   +1 more source

Numerical analysis of the use of multiple inlet plates to improve the thickness uniformity of silicon epitaxial layers during atmospheric pressure chemical vapor deposition

Results in Engineering
The further reduction of semiconductor nanometer line width has led to increasingly higher silicon epitaxial film surface flatness requirement. This study conducts a series of numerical simulations to examine the use of multiple inlet plates in an ...
Ba-Phuoc Le, Jyh-Chen Chen, Chieh Hu, Wei-Jie Lin, Chun-Chin Tu, Liang-Chin Chen   +5 more
doaj   +1 more source

Steps towards the development of an experimentally verified simulation of pool nucleate boiling on a silicon wafer with artificial sites

, 2009
Nucleate boiling is a very effective heat transfer cooling process, used in numerous industrial applications. Despite intensive research over decades, a reliable model of nucleate pool boiling is still not available.
Pavlovic, E, Hutter, C, Sanna, A, Nelson, RA, Karayiannis, TG, Golobic, I, Kenning, DBR, Sefiane, K, Walton, AJ   +8 more
core  

Silicon Wafer Processing.

, 2016
A) Silicon Wafer Substrate Preparation. 1) After silicon wafers obtained, 2) thermal oxide deposited on Silicon wafers. 3) Then, the wafer was uniformly coated with P5107 (photoresist, Rohm and Haas Chemicals), using a RF3S coater (Sokudo).
Hari K. Krishnamurthy (2506957), Carol T. Van Dyke (2506942), Kang Bei (2506936), Vasanth Jayaraman (2506939), Rok Seon Choung (2506954), Tricia L. Brantner (2506945), Karthik Krishna (2506948), Melissa R. Snyder (418027), Eric V. Marietta (169348), Joseph A. Murray (156117), Pankaj J. Pasricha (351642), John Rajasekaran (2506951), Tianhao Wang (695342)   +12 more
core   +1 more source

Thermally Pre‐Formed Reconfigurable Resistive Random‐Access Memory Crossbar Arrays: A Dual‐Mode Platform for Robust Physically Unclonable Functions and In‐Memory Computing

Advanced Functional Materials, EarlyView.
A reconfigurable RRAM platform utilizing thermally pre‐formed filaments (TPFs) is developed to realize robust hardware security. By exploiting the thermodynamic stochasticity of TPFs, exceptionally reliable physically unclonable functions (PUFs) are achieved.
Seongbin Kwon, Taewon Lee, Dohyeong Kim, Sungmin Hwang, Sungjoon Kim   +4 more
wiley   +1 more source

Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface. [PDF]

Materials (Basel), 2023
Liang L, Li S, Lan K, Yu R, Wang J, Zhao W.   +5 more
europepmc   +1 more source

Interface Effects in Ultrathin Silicon on Insulator Films

Advanced Functional Materials, EarlyView.
This work establishes a systematic framework to discriminate how bulk and interface phenomena affect charge transport in ultrathin P‐doped silicon‐on‐insulator (SOI) films. For Si films below 15 nm, electrical characterization demonstrates that interface states drive charge transport, shifting the metal‐insulator transition (MIT) critical dopant ...
Andrea Pulici, Gabriele Seguini, Fabiana Taglietti, Roman Gumeniuk, Riccardo Chiarcos, Michele Laus, Johannes Heitmann, Marco Fanciulli, Michele Perego   +8 more
wiley   +1 more source

An all ambient, room temperature-processed solar cell from a bare silicon wafer. [PDF]

PNAS Nexus, 2023
Okamoto K, Fujita Y, Nishigaya K, Tanabe K.   +3 more
europepmc   +1 more source

Simulation and experimental investigation of pool boiling on a silicon wafer with artificial nucleation sites

, 2008
This paper reports progress on a project to develop a design tool for large arrays of nucleation sites at specified locations to achieve high rates of cooling by pool boiling. The tool will be based on an improved version of a hybrid simulation, in which
Pavlovic, E, Hutter, C, Sanna, A, Nelson, RA, Lin, H, Golobic, I, Karayiannis, TG, Kenning, DBR, Sefiane, K, Walton, AJ   +9 more
core  

Aluminum nitride for heatspreading in RF IC’s

, 2008
To reduce the electrothermal instabilities in silicon-on-glass high-frequency bipolar devices, the integration of thin-film aluminum nitride as a heatspreader is studied.
Clement Lorenzo, Marta, Schellevis, H., Olivares Roza, Jimena, Nanver, L.K., Iborra Grau, Enrique, La Spina, L.   +5 more
core   +1 more source