Results 81 to 90 of about 35,929 (259)
A Wafer-Level Fabricated Heating–Vacuum Micro-Platform with Resonant MEMS Monolithically Integrated
This paper presents a silicon-based wafer-level vacuum packaging platform with a monolithically integrated micro-oven. This system provides vacuum and constant temperature operating conditions to improve the performance of resonant micro-electro ...
Kaixuan He +7 more
doaj +1 more source
Synthesis of Silicon Nitride Nanoparticles by Upcycling Silicon Wafer Waste Using Thermal Plasma Jets. [PDF]
Kim TH, Lee S, Park DW.
europepmc +1 more source
Opportunities of Semiconducting Oxide Nanostructures as Advanced Luminescent Materials in Photonics
The review discusses the challenges of wide and ultrawide bandgap semiconducting oxides as a suitable material platform for photonics. They offer great versatility in terms of tuning microstructure, native defects, doping, anisotropy, and micro‐ and nano‐structuring. The review focuses on their light emission, light‐confinement in optical cavities, and
Ana Cremades +7 more
wiley +1 more source
The further reduction of semiconductor nanometer line width has led to increasingly higher silicon epitaxial film surface flatness requirement. This study conducts a series of numerical simulations to examine the use of multiple inlet plates in an ...
Ba-Phuoc Le +5 more
doaj +1 more source
Silicon Wafer CMP Slurry Using a Hydrolysis Reaction Accelerator with an Amine Functional Group Remarkably Enhances Polishing Rate. [PDF]
Bae JY +7 more
europepmc +1 more source
This study demonstrates a self‐assembly process to generate free‐standing piezoelectric nanomembranes, forming ultracompact microtubular acoustic wave sensors and actuators. The miniaturized 3D piezoelectric platform reported in this work can be applied in telecommunication, energy harvesting, and acoustofluidics. Moreover, the 3D self‐assembly can add
Raphaël C. L‐M. Doineau +9 more
wiley +1 more source
In grinding process, there will inevitably produce subsurface microcrack damages on the monocrystalline silicon wafer. The subsurface microcrack damages of monocrystalline silicon wafer are nondestructively detected by the polarized laser scattering ...
LI Qingpeng, BAI Qian, ZHANG Bi
doaj
Rapid, noncontact, sensitive, and semiquantitative characterization of buffered hydrogen-fluoride-treated silicon wafer surfaces by terahertz emission spectroscopy. [PDF]
Yang D +3 more
europepmc +1 more source
Magnetic tunnel junctions (MTJs) using MgO tunnel barriers face challenges of high resistance‐area product and low tunnel magnetoresistance (TMR). To discover alternative materials, Literature Enhanced Ab initio Discovery (LEAD) is developed. The LEAD‐predicted materials are theoretically evaluated, showing that MTJs with dusting of ScN or TiN on ...
Sabiq Islam +6 more
wiley +1 more source
Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. [PDF]
Wang Z +15 more
europepmc +1 more source

