Results 71 to 80 of about 54,444 (308)

Transfer Printing and Reconfiguration of Soft Electronics Using Digital Microfluidics and Laser Machining

open access: yesAdvanced Functional Materials, EarlyView.
This paper presents a digital microfluidics‐based technique for transferring and reconfiguring soft nanomembranes. Laser‐machined nanothin membranes are picked up, transported, and aligned via tailored surface tension and the actuation of water droplets, enabling the development of flexible electronics, the integration of functional materials on 3D ...
Quang Anh Nguyen   +15 more
wiley   +1 more source

Electrode and Microstructure Dependence of Oxygen Diffusion in Ferroelectric Hafnium Zirconium Oxide Thin Films

open access: yesAdvanced Functional Materials, EarlyView.
Significant nanoscale oxygen diffusion coefficient variations are measured in ferroelectric hafnium zirconium oxide films with grain boundaries and electrode interfaces exhibiting values 104 times larger than the grain cores. Overall coefficients are 10X larger for films prepared with metal nitride electrodes compared to refractory metals. New insights
Liron Shvilberg   +6 more
wiley   +1 more source

Near‐Infrared Light‐Driven Zn/Au Janus Micromotors for Multiplex SERS Detection of Anticancer Drugs

open access: yesAdvanced Functional Materials, EarlyView.
Zn/Au Janus micromotors, propelled by thermophoretic effects under NIR light, function as active SERS platforms for single and multiplex detection of anticancer drugs. Their dynamic motion enhances analyte exchange at the Au interface, reducing saturation and competitive adsorption, thereby improving sensitivity and extending the linear detection range.
Tijana Maric   +8 more
wiley   +1 more source

Wafer bonding for optical MEMS

open access: yes, 2022
S.184-193A low temp. direct bonding method that is CMOS compatible is described. The method is applied in the manufg. of advanced spatial light modulators with a matrix of up to 512 * 2048 individually addressable monocryst. silicon mirrors.
Völker, B.   +4 more
core  

Resolving the Cu(bdc) Conundrum: Identifying Non‐Porous Packing of Prototypical Coordination‐Network Thin Films Combining Advanced Diffraction Techniques and Computational Modelling

open access: yesAdvanced Functional Materials, EarlyView.
Solution‐processed Cu(bdc) forms prototypical MOF thin films for which a multitude of not fully satisfactory structural models have been suggested. Combining rotating grazing‐incidence diffraction and X‐ray reflectivity on two complementary samples with density‐functional theory, we first discard the previously suggested models and then identify a non ...
Narges Taghizade   +7 more
wiley   +1 more source

Molecular Dynamics Analysis of Adhesive Forces between Silicon Wafer and Substrate in Microarray Adhesion

open access: yesLubricants
With the development of the electronics industry, the requirements for chips are getting higher and higher, and thinner and thinner wafers are needed to meet the processing of chips. In this study, a model of the adhesion state of semiconductor wafers in
Shunkai Han   +5 more
doaj   +1 more source

Modelling of an industrial moving belt chemical vapour deposition reactor forming SiO2 films [PDF]

open access: yes, 2005
In order to improve the efficiency of an industrial atmospheric pressure chemical vapour deposition (APCVD) moving belt reactor depositing silicon dioxide SiO2 films from tetraethoxysilane Si(OC2H5)4 (TEOS) andozone O3, a 2D simulation model based on the
Caussat, Brigitte   +5 more
core   +1 more source

Unraveling the Electronic Structure of Silicon Vacancy Centers in 4H‐SiC

open access: yesAdvanced Functional Materials, EarlyView.
The electronic structure of the silicon vacancy in 4H‐SiC is probed via transient absorption spectroscopy, uncovering previously inaccessible excited states of the quartet and doublet spin channels, including the V2' transition. In combination with theoretical analysis, a comprehensive picture of the electronic structure is established.
Ali Tayefeh Younesi   +9 more
wiley   +1 more source

Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation

open access: yesAIP Advances, 2018
Ultra-thin silicon wafer is highly demanded by semi-conductor industry. During wafer thinning process, the grinding technology will inevitably induce damage to the surface and subsurface of silicon wafer. To understand the mechanism of subsurface damage (
Zhiwei Zhang   +4 more
doaj   +1 more source

Mechanical Stability in Crystalline Silicon Solar Cells

open access: yes, 2010
Mechanical stability of back contact solar cells deteriorates when holes (MWT, EWT) or grooves (TWT) are created in the wafer. These operations are essential for these structures so we found necessary to quantify the magnitude of this damage.
Gutierrez, José Rubén   +3 more
core  

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