Results 51 to 60 of about 37,067 (160)

Numerical analysis of the use of multiple inlet plates to improve the thickness uniformity of silicon epitaxial layers during atmospheric pressure chemical vapor deposition

open access: yesResults in Engineering
The further reduction of semiconductor nanometer line width has led to increasingly higher silicon epitaxial film surface flatness requirement. This study conducts a series of numerical simulations to examine the use of multiple inlet plates in an ...
Ba-Phuoc Le   +5 more
doaj   +1 more source

Fabrication of 2-D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array through Silicon Wafer Bonding. [PDF]

open access: yesMicromachines (Basel), 2022
Wang Z   +15 more
europepmc   +1 more source

Wafer-Scale ALD Synthesis of MoO3 Sulfurized to MoS2

open access: yesCrystals
Silicon has dimensional limitations in following Moore’s law; thus, new 2D materials complementing Silicon are being researched. Molybdenum disulfide (MoS2) is a prospective material anticipated to bridge the gap to complement Silicon and enhance the ...
Sachin Shendokar   +2 more
doaj   +1 more source

OBSERVING ACTIVE AREA ON NATIVE OXIDE GROWTH: MICROFABRICATION & FAILURE ANALYSIS LAB

open access: yesJournal of Academia
Native oxide is a very thin layer of silicon dioxide (SiO2) that formed on the surface of a silicon wafer whenever the wafer is exposed to air under ambient conditions.
Norlida Abu Bakar   +7 more
doaj  

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