Results 31 to 40 of about 54,444 (308)
Silicon Microdisk Resonators for Nonlinear Optics and Dynamics [PDF]
, 2009 Silicon is incredibly well-studied as an electronic material. Since the out-migration of William Noyce, Gordon Moore, and the rest of the original Fairchild Semiconductor class from Shockley Semiconductor, silicon has only grown in prominence.
Johnson, Thomas James
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Double‐sided transistor device processability of carrierless ultrathin silicon wafers
InfoMat, 2020 Double‐sided metal‐oxide‐semiconductor field‐effect‐transistor processing is demonstrated for the first time on an ultrathin crystalline silicon substrate of 6‐20 μm in a 100 mm diameter wafer format without a carrier wafer, the thinnest free‐standing ...
Ruby A. Lai +3 more
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Modern Electronic Materials, 2019 Gettering of rapidly diffusing metallic impurities and structural defects in silicon which is the main material for IC fabrication, high-power high-voltage devices and neutron doped silicon has been studied.
Vyacheslav A. Kharchenko
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Development of an original model for the synthesis of silicon nanodots by Low Pressure Chemical Vapor Deposition [PDF]
, 2008 Using the Computational Fluid Dynamics code Fluent, a simulation model of an industrial Low Pressure Chemical Vapor Deposition reactor has been developed for the synthesis of silicon nanodots from silane SiH4 on silicon dioxide SiO2 substrates.
Billon, Thierry +4 more
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Micromachines, 2016 This paper presents a process for the fabrication of vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using glass reflow and anodic bonding techniques.
Nguyen Van Toan +3 more
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Fabrication of wafer-level thermocompression bonding
, 2002 Thermocompression bonding of gold is a promising technique for achieving low temperature, wafer-level bonding. The fabrication process for wafer bonding at 300ºC via compressing gold under 7 MPa of pressure is described in detail.
Tsau, C.H. +2 more
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Micromachines, 2021 Lower warp is required for the single crystal silicon wafers sawn by a fixed diamond wire saw with the thinness of a silicon wafer. The residual stress in the surface layer of the silicon wafer is the primary reason for warp, which is generated by the ...
Tengyun Liu, Peiqi Ge, Wenbo Bi
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Development of Biocompatible Parylene Neurocages for Action Potential Stimulation and Recording [PDF]
, 2007 Neurons, and the neural networks they form, are at the heart of our biological and cognitive functions. Traditional in vitro techniques for studying neural networks use two-dimensional multi-electrode arrays.
Tooker, Angela Colleen
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Characterization of wafer-level thermocompression bonds
, 2004 Thermocompression bonding joins substrates via a bonding layer. In this paper, silicon substrates were bonded using gold thin films. Experimental data on the effects of bonding pressure (30 to 120 MPa), temperature (260 and 300/spl deg/C), and time (2 to
Tsau, C.H. +2 more
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Locally erasable couplers for optical device testing in silicon on insulator
, 2014 Wafer scale testing is critical to reducing production costs and increasing production yield. Here we report a method that allows testing of individual optical components within a complex optical integrated circuit.
Payne, D.N.R. +17 more
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