Nucleate pool boiling investigation on a silicon test section with micro-fabricated cavities [PDF]
, 2009 The basic mechanisms of nucleate boiling are still not completely understood, in spite of the many numerical and experimental studies dedicated to the topic.
Hutter, C +5 more
core +6 more sources
Investigation into the wafer-scale integration of fine-grain parallel processing computer systems [PDF]
, 1986 This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.This thesis investigates the potential of wafer-scale integration (WSI) for the implementation of low-cost fine-grain parallel processing computer systems ...
Jones, Simon Richard
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Steps towards the development of an experimentally verified simulation of pool nucleate boiling on a silicon wafer with artificial sites [PDF]
, 2009 Nucleate boiling is a very effective heat transfer cooling process, used in numerous industrial applications. Despite intensive research over decades, a reliable model of nucleate pool boiling is still not available.
Pavlovic, E +8 more
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Simulation of silicon wafers heating during rapid thermal processing using “UBTO 1801” unit
Доклады Белорусского государственного университета информатики и радиоэлектроники, 2020 The present work is devoted to determination of the dependence of the heating temperature of the silicon wafer on the lamps power and the heating time during rapid thermal processing using “UBTO 1801” unit by irradiating the wafer backside with an ...
J. A. Solovjov +2 more
doaj +1 more source
The improvement of the cone defect of domestic silicon wafer
上海师范大学学报. 自然科学版, 2020 The cone defects in the verification of domestic silicon wafer were focused and studied in the paper.By optimizing the control of the waiting time in pulling and producing during the silicon wafers process, the cone defects of silicon wafers were reduced
LU Zhenjie, LI Jie, LANG Yuhong
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Effect of nanotopogranphy in direct wafer bonding: modeling and measurements [PDF]
, 2005 Nanotopography, which refers to surface height variations of tens to hundreds of nanometers that extend across millimeter-scale wavelengths, is a wafer geometry feature that may cause failure in direct wafer bonding processes.
W.A. Baylies +12 more
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Applied Surface Science Advances, 2022 The aim of this paper, the improvement of optical properties of as-cut boron doped p-type multi-crystalline silicon (mc-Silicon) wafer grains obtained by chemical texturization is presented.
Madhesh Raji +4 more
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Using Anisotropic Silicon Etch for Change the Crystal Orientation of Silicon Wafer [PDF]
Engineering and Technology Journal, 2012 In this work، anisotropic silicon etch using KOH ، optical microscopic and X-ray diffraction testing، were used to determine the crystal orientation of the silicon wafer(100) plane , where the mechanical polishing and wet etching described the geometric ...
Saria D.mohammed +2 more
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3D characterisation of tool wear whilst diamond turning silicon [PDF]
, 2006 Nanometrically smooth infrared silicon optics can be manufactured by the diamond turning process. Due to its relatively low density, silicon is an ideal optical material for weight sensitive infrared (IR) applications. However, rapid diamond tool edge
Luo, X. +5 more
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Progress and Prospect of Semiconductor Silicon Wafers in China
中国工程科学, 2023 Silicon wafers are fundamental materials for semiconductors. China's semiconductor silicon wafers are highly dependent on foreign trade. Enhancing the independent guarantee capability of silicon wafers is significant for improving the overall level of ...
Zhang Guohu, Xiao Qinghua, Ma Fei
doaj +1 more source