Results 11 to 20 of about 54,444 (308)

Classification of Silicon (Si) Wafer Material Defects in Semiconductor Choosers using a Deep Learning ShuffleNet-v2-CNN Model

open access: yesAdvances in Materials Science and Engineering, 2022
The silicon wafer is one of the raw materials used to make semiconductor chipsets. Semiconductor failure or dysfunction could be the result of defects in the layers of this material. As a result, it is essential to work toward the development of a system
Rajesh Doss   +5 more
doaj   +1 more source

Simulation of silicon wafers heating during rapid thermal processing using “UBTO 1801” unit

open access: yesДоклады Белорусского государственного университета информатики и радиоэлектроники, 2020
The present work is devoted to determination of the dependence of the heating temperature of the silicon wafer on the lamps power and the heating time during rapid thermal processing using “UBTO 1801” unit by irradiating the wafer backside with an ...
J. A. Solovjov   +2 more
doaj   +1 more source

The improvement of the cone defect of domestic silicon wafer

open access: yes上海师范大学学报. 自然科学版, 2020
The cone defects in the verification of domestic silicon wafer were focused and studied in the paper.By optimizing the control of the waiting time in pulling and producing during the silicon wafers process, the cone defects of silicon wafers were reduced
LU Zhenjie, LI Jie, LANG Yuhong
doaj   +1 more source

Novel chemical texturizing process in Boron–doped As-cut multi-crystalline silicon wafer for increasing the optical properties

open access: yesApplied Surface Science Advances, 2022
The aim of this paper, the improvement of optical properties of as-cut boron doped p-type multi-crystalline silicon (mc-Silicon) wafer grains obtained by chemical texturization is presented.
Madhesh Raji   +4 more
doaj   +1 more source

Using Anisotropic Silicon Etch for Change the Crystal Orientation of Silicon Wafer [PDF]

open access: yesEngineering and Technology Journal, 2012
In this work، anisotropic silicon etch using KOH ، optical microscopic and X-ray diffraction testing، were used to determine the crystal orientation of the silicon wafer(100) plane , where the mechanical polishing and wet etching described the geometric ...
Saria D.mohammed   +2 more
doaj   +1 more source

Progress and Prospect of Semiconductor Silicon Wafers in China

open access: yes中国工程科学, 2023
Silicon wafers are fundamental materials for semiconductors. China's semiconductor silicon wafers are highly dependent on foreign trade. Enhancing the independent guarantee capability of silicon wafers is significant for improving the overall level of ...
Zhang Guohu, Xiao Qinghua, Ma Fei
doaj   +1 more source

Introduction of IC Manufacturing to Amateurs [PDF]

open access: yesSHS Web of Conferences, 2023
In the fabrication of silicon wafers to create integrated circuits, chemistry and physics play a significant role. It is important to change the silicon wafer surface conditions and properties using both innocuous and harmful compounds, particular and ...
Chen Linxuan, Wang Zilong, Wang Zishuo
doaj   +1 more source

Detection of Monocrystalline Silicon Wafer Defects Using Deep Transfer Learning

open access: yesJournal of Telecommunications and Information Technology, 2022
Defect detection is an important step in industrial production of monocrystalline silicon. Through the study of deep learning, this work proposes a framework for classifying monocrystalline silicon wafer defects using deep transfer learning (DTL).
Adriana Ganum   +3 more
doaj   +1 more source

Optimization of Electroplating on Silicon Wafer

open access: yesThe Proceedings of The Computational Mechanics Conference, 2000
A new method, combination of a boundary element method and a finite element method, has been developed to simulate the electroplating of a silicon wafer with copper. In this method, the Laplace equation is solved by representing the complicated phenomena near the anode and cathode surface as polarization characteristics (PCs) and using the PCs as ...
AOKI, Shigeru   +3 more
openaire   +3 more sources

Effect of nanotopogranphy in direct wafer bonding: modeling and measurements [PDF]

open access: yes, 2005
Nanotopography, which refers to surface height variations of tens to hundreds of nanometers that extend across millimeter-scale wavelengths, is a wafer geometry feature that may cause failure in direct wafer bonding processes.
W.A. Baylies   +12 more
core   +1 more source

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