Results 61 to 70 of about 35,929 (259)

Noise‐Limited Bit Precision in Ferroelectric Synaptic Transistors for High‐Resolution Neuromorphic Computing

open access: yesAdvanced Functional Materials, EarlyView.
Low‐frequency noise spectroscopy defines the resolvable conductance states of synaptic FeFETs by coupling read‐current fluctuation with usable dynamic range. The resulting noise‐limited bit precision establishes a universal, device‐agnostic reliability metric beyond the memory window, enabling quantitative benchmarking and rational design of high ...
Jaehong Park   +12 more
wiley   +1 more source

Conformational Switching of Proteins on Material Surfaces Enabled by Peptide‐Oriented Adsorption

open access: yesAdvanced Functional Materials, EarlyView.
Responsive biointerfaces could be achieved using conformationally responsive proteins; however, their interconversion can be lost upon surface adsorption. Herein, we demonstrate that the incorporation a Au binding peptide into calmodulin allows for binding control on Au wherein the protein retains conformational switching. This capability was confirmed
Sakthirupini Ramamurthy   +7 more
wiley   +1 more source

Sulfur‐Free Ultrahigh‐Refractive‐Index Polymers Enabled by Densely Packed Oxygen‐Bridged Dibenzofuran‐Cardo Architectures

open access: yesAdvanced Functional Materials, EarlyView.
A new class of sulfur‐free, oxygen‐bridged dibenzofuran‐based polymers is developed for ultrahigh‐refractive‐index applications. The rigid π‐extended architecture and enhanced molecular polarizability enable exceptional optical performance, combining refractive indices up to 1.848 with high Abbe numbers and full visible transparency. This work offers a
Hend A. Hegazy   +5 more
wiley   +1 more source

Simulation of micro contact based on interacting force in self rotating grinding of silicon wafer

open access: yesJin'gangshi yu moliao moju gongcheng, 2016
Self rotating grinding with cup diamond wheel is a typical ultra precision grinding process for silicon wafer.The simulation model based on the force of micro contact between wheel micro unit and silicon wafer is established from the stable ductile ...
REN Qinglei   +3 more
doaj  

Molecular Dynamics Analysis of Adhesive Forces between Silicon Wafer and Substrate in Microarray Adhesion

open access: yesLubricants
With the development of the electronics industry, the requirements for chips are getting higher and higher, and thinner and thinner wafers are needed to meet the processing of chips. In this study, a model of the adhesion state of semiconductor wafers in
Shunkai Han   +5 more
doaj   +1 more source

Reconfigurable Au Nanoparticle Monolayers on Regenerated Cellulose Hydrogels: Highly Sensitive SERS Detection of Polystyrene Micro/Nanoplastics With Interpretable Deep Learning

open access: yesAdvanced Functional Materials, EarlyView.
A regenerated cellulose (RC) hydrogel‐based SERS substrate integrating a Marangoni‐transferred gold nanoparticle self‐assembled monolayer (Au‐SAM) is fabricated. Reswelling‐induced hotspot formation enhances polystyrene micro/nanoplastics (PS MNPs) detection in complex matrices, providing reproducible, high‐throughput SERS signals across diverse ...
Youngho Jeon   +5 more
wiley   +1 more source

Imaging the Thickness‐Dependent Formation of Schottky Barriers in Metal–Semiconductor van der Waals Heterostructures

open access: yesAdvanced Functional Materials, EarlyView.
Using nanobeam photoemission, we demonstrate imaging of the in‐plane and out‐of‐plane electric field landscape within a metal–semiconductor van der Waals heterostructure. We provide evidence for Schottky barrier formation that depends on the semiconductor thickness. ABSTRACT Achieving high‐performance optoelectronic devices based on two‐dimensional van
Dario Mastrippolito   +17 more
wiley   +1 more source

Enhancing Slurry Stability and Surface Flatness of Silicon Wafers through Organic Amine-Catalyzed Synthesis Silica Sol

open access: yesNanomaterials
The stability of slurries used for chemical mechanical polishing (CMP) is a crucial concern in industrial chip production, influencing both the quality and cost-effectiveness of polishing fluids.
Yi Xing   +3 more
doaj   +1 more source

Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation

open access: yesAIP Advances, 2018
Ultra-thin silicon wafer is highly demanded by semi-conductor industry. During wafer thinning process, the grinding technology will inevitably induce damage to the surface and subsurface of silicon wafer. To understand the mechanism of subsurface damage (
Zhiwei Zhang   +4 more
doaj   +1 more source

Self‐Assembled Lipids as Soft Dielectrics

open access: yesAdvanced Functional Materials, EarlyView.
Self‐assembled lipid bilayers serve as soft dielectric materials for ultrathin electronics. Using liquid‐metal parallel‐plate junctions, the capacitance and dielectric breakdown of dehydrated lipid films are characterized. Dielectric behavior is controlled by lipid molecular structure, cholesterol content, and assembly conditions, providing molecular ...
Hao Yang   +4 more
wiley   +1 more source

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