Results 151 to 160 of about 54,444 (308)

Picosecond Laser Micro-welded Similar and Dissimilar Material

open access: yes, 2014
We report the successful picoseconds laser welding of a range of similar and dissimilar materials. The welds are formed by a tightly focused 1030 nm, 5.9 ps, 400 kHz laser system which induces microplasma formation.
Thomson, Robert R   +4 more
core  

Super‐Resolution Ultrasound Based Cell Tracking With Polymeric Nanobubbles

open access: yesAdvanced Materials, EarlyView.
This study presents a super‐resolution ultrasound platform for tracking cells in vivo. Biocompatible polymeric nanobubbles are used as highly echogenic intracellular labels. Following the injection of cells and microbubbles, ultrasound localization microscopy (ULM) can dynamically match the microvascular architecture and individual cell trajectories ...
Junlin Chen   +19 more
wiley   +1 more source

Efficient Osmotic Energy Conversion Enabled by Self‐Standing COF Membranes With Varied Sulfonic Acid Group Density

open access: yesAdvanced Materials, EarlyView.
Self‐standing, strong sulfonated covalent organic framework membranes with varied ionic‐group density are developed for osmotic energy conversion. Optimized charge‐governed nanochannels enable highly selective ion transport, delivering a power density of 24.53 W m−2 under seawater/freshwater salinity gradients.
Xi Ma   +5 more
wiley   +1 more source

Automated multi-process transport line for silicon wafer processing

open access: yes
The semiconductor industry is a rapidly growing industry that has become an integral part of modern technology. Silicon wafer processing is a crucial step in the manufacturing of semiconductors, which requires a high degree of precision and consistency ...
Esan, Oladele
core  

High Center‐of‐Mass, Multi‐Legged Soft Robots Powered by Geometrically Encoded Liquid Crystal Elastomer Arc Appendages

open access: yesAdvanced Materials, EarlyView.
Inspired by the octopus and the golden wheel spider, soft robots with liquid crystal elastomer arc fibers as appendages are fabricated to transcend surface constraints through an elevated center of mass and minimal contact footprints. By leveraging curvature‐encoded deformation‐recovery cycles, these robots exhibit contractile, torsional, and flexural ...
Jong Bin Kim   +5 more
wiley   +1 more source

Measuring and Manipulating Density of States in Two‐Dimensional Materials With Electrochemical Capacitance

open access: yesAdvanced Materials Interfaces, EarlyView.
We report electrochemical quantum capacitance spectroscopy as an ambient, in situ probe for defect‐mediated electronic structure at 2D material interfaces. Using monolayer MoS2, the method resolves band edges and vacancy states, tracks sulfur‐vacancy evolution during hydrogen evolution, and links interfacial density‐of‐states changes to nearly ...
Mengyu Yan   +9 more
wiley   +1 more source

Biodegradable Chitosan Films as Green Resists for Gold Nanowires Fabrication Through AFM‐Based Nanolithography

open access: yesAdvanced Materials Interfaces, EarlyView.
Schematic illustration of a sustainable nanofabrication process: chitosan derived from natural sources is used as a biodegradable thin film resist, patterned via Constant Pulse‐Assisted Force Lithography (CP‐AFL) to create tunable nanogrooves. These grooves template gold nanowire formation, enabling high‐resolution nanopatterning under ambient ...
Paolo Pellegrino   +7 more
wiley   +1 more source

Cost-Effective TSV Grouping for Yield Improvement of 3D-ICs

open access: yes
Three-dimensional Integrated Circuits (3D-ICs) vertically stack multiple silicon dies to reduce overall wire length, power consumption, and allow integration of heterogeneous technologies.
Khursheed, Saqib   +2 more
core  

Low-temperature (10 K) infrared measurement of interstitial oxygen in heavily antimony-doped silicon via wafer thinning

open access: yes, 1997
A new technique is reported for the rapid determination of interstitial oxygen in heavily Sb-doped silicon. This technique includes wafer thinning and low-temperature 10 K infrared measurement on highly thinned wafers.
Cai TH   +4 more
core  

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