Results 281 to 290 of about 260,171 (362)

Silicone‐based biomaterials for biomedical applications: Antimicrobial strategies and 3D printing technologies

open access: yesJournal of Applied Polymer Science, 2021
Silicone is a synthetic polymer widely used in the biomedical industry as implantable devices since 1940, owing to its excellent mechanical properties and biocompatibility.
Erfan Rezvani Ghomi   +2 more
exaly   +2 more sources

A silicone-based support material eliminates interfacial instabilities in 3D silicone printing

Science, 2023
Among the diverse areas of 3D printing, high-quality silicone printing is one of the least available and most restrictive. However, silicone-based components are integral to numerous advanced technologies and everyday consumer products.
Senthilkumar Duraivel   +8 more
semanticscholar   +1 more source

3D Printed Multifunctional, Hyperelastic Silicone Rubber Foam

open access: yesAdvanced Functional Materials, 2019
Highly elastic silicone foams, especially those with tunable properties and multifunctionality, are of great interest in numerous fields. However, the liquid nature of silicone precursors and the complicated foaming process hinder the realization of its ...
Qiyi Chen, E V Shchepkina, Peng-fei Cao
exaly   +2 more sources

How to tailor flexible silicone elastomers with mechanical integrity: a tutorial review

open access: yesChemical Society Reviews, 2019
The tutorial aims to equip the beginners in silicone research with the knowledge to formulate recipes and process elastomer networks, targeting specific properties related to soft applications such as stretchable electronics without compromising the ...
Sindhu Vudayagiri   +2 more
exaly   +2 more sources

Silicone-Coated MXene/Cellulose Nanofiber Aerogel Films with Photothermal and Joule Heating Performances for Electromagnetic Interference Shielding

ACS Applied Nano Materials, 2021
Aerogels with a larger specific surface area and lightweight property have aroused tremendous attention in recent years. Functional aerogel materials have shown applications in the fields of industry, environment, biomedicine, and so forth.
Wei Xin, Mingguo Ma, F. Chen
semanticscholar   +1 more source

3D-Printed Ultra-Robust Surface-Doped Porous Silicone Sensors for Wearable Biomonitoring.

ACS Nano, 2020
Three-dimensional flexible porous conductors have significantly advanced wearable sensors and stretchable devices due to their specific high surface area.
Elham Davoodi   +10 more
semanticscholar   +1 more source

Gluing silicon with silicone

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 1998
Abstract Problems and solutions concerning the gluing of silicon detectors are discussed. The R & D work for the HERA- B vertex detector system led to gluing studies with epoxy and silicone-based adhesives used on ceramics and carbon fibre. The HERA- B solution using a silicone glue is presented.
Abt, I.   +8 more
openaire   +3 more sources

Strained-Silicon on Silicon and Strained-Silicon on Silicon-Germanium on Silicon by Relaxed Buffer Bonding

Journal of The Electrochemical Society, 2006
We report the creation of two novel complementary metal oxide semiconductor CMOS -compatible platforms: strained-silicon onsilicon SSOS and strained-silicon on silicon-germanium on silicon SGOS . SSOS substrate has an epitaxially defined, strained-silicon layer directly on silicon wafer without an intermediate SiGe or oxide layer. SSOS is a homochemical
David M. Isaacson   +5 more
openaire   +2 more sources

Novel Eco-Friendly Flame Retardants Based on Nitrogen–Silicone Schiff Base and Application in Cellulose

, 2020
A novel schiff base (BD) containing nitrogen and silicone was prepared, and a phosphorus–nitrogen silicone flame retardant (BDD) was synthesized based on BD and 9,10-dihydro-9-oxa-10-phosphaphenant...
Na Li   +8 more
semanticscholar   +1 more source

Silicon-On-Silicon Packaging

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
Honeywell's new packaging technique uses silicon as a multichip substrate. Multiple integrated circuit (IC) chips are flip bonded by controlled collapse joining to a silicon substrate. The silicon substratc provides the interconnections between chips and the next level of interface.
W. Nunne   +5 more
openaire   +2 more sources

Home - About - Disclaimer - Privacy