Results 251 to 260 of about 2,422,228 (271)

Shear strength and fracture behavior of reflowed Sn3.0Ag0.5Cu/Cu solder joints under various strain rates

, 2017
Xiao-Wu Hu, Tao Xu, L. Keer, Yu-Long Li, Xiong-Xin Jiang   +4 more
semanticscholar   +1 more source

Finite Element Analysis for Reliability of Solder Joints Materials in the Embedded Package

Electronic Materials Letters, 2019
Youngbae Ko, Seunghyun Cho
exaly  

Electromigration in Solder Joints

Journal of The Japan Institute of Electronics Packaging, 2020
openaire   +1 more source

Interfacial behaviors of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints during electromigration

Microelectronics and reliability, 2017
Feng-Jiang Wang, Dong-Yang Li, Shuang Tian, Zhi-Jie Zhang, Jiheng Wang, Chao Yan   +5 more
semanticscholar   +1 more source

Thermal fatigue behaviors of Sn–4Ag/Cu solder joints at low strain amplitude

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2013
Q K Zhang
exaly  

Solder joint

1995
FERRANDO CARLO, CHAN STEPHEN
openaire   +1 more source

Effects of ZrO nanoparticles on the mechanical properties of Sn–Zn solder joints on Au/Ni/Cu pads

Journal of Alloys and Compounds, 2009
exaly  

Improving mechanical and electrical properties of Cu/SAC305/Cu solder joints under electromigration by using Ni nanoparticles doped flux

Journal of Materials Science: Materials in Electronics, 2018
M. Bashir, A. A. Haseeb
semanticscholar   +1 more source

SOLDER JOINT

2010
openaire   +4 more sources

Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties

, 2017
X. Tu, D. Yi, Jing Wu, Bin Wang
semanticscholar   +1 more source