Results 231 to 240 of about 7,263 (261)
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Abstract This chapter focuses on factors that influence the mechanical properties of a soldered joint, including solder material, base material, solder joint design, soldering surface, soldering temperature, and test methodology.
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A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
International Journal of Plasticity, 2022YILUN Xu, J W Xian, Stoyan Stoyanov
exaly
SOLDERABILITY - THE KEY TO SOLDER JOINT RELIABILITY
Symposium on Deep Submergence Propulsion and Marine Systems, 1966openaire +1 more source
Electromigration in Solder Joints
Journal of The Japan Institute of Electronics Packaging, 2020openaire +1 more source
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Materials Science and Engineering Reports, 2002K N Tu
exaly
Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints
Journal of Alloys and Compounds, 2006Y C Chan, M O Alam, B Y Wu
exaly
Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2005Z Lai
exaly

