Results 231 to 240 of about 2,422,228 (271)

SOLDERABILITY - THE KEY TO SOLDER JOINT RELIABILITY

Symposium on Deep Submergence Propulsion and Marine Systems, 1966
openaire   +1 more source

Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

Journal of Alloys and Compounds, 2006
M O Alam, B Y Wu
exaly  

The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder joints

Journal of Electronic Materials, 1994
D B Knorr
exaly  

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 2005
Z Lai
exaly  

SOLDER ALLOY, SOLDER BALL, SOLDER PREFORM, SOLDER PASTE AND SOLDER JOINT

2021
IIJIMA YUKI, NOMURA HIKARU, SAITO TAKASHI, IZUMITA NAOKO, YOSHIKAWA SHUNSAKU   +4 more
openaire   +1 more source

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Materials Science and Engineering Reports, 2002
K Zeng, K N Tu
exaly  

Solder alloy, solder paste, solder ball, solder preform, and solder joint

2023
KAWASAKI HIROYOSHI, SHIRATORI MASATO, KAWAMATA YUJI   +2 more
openaire   +1 more source

SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT STRUCTURE

2014
KAO KUO-SHU, CHANG TAO-CHIH, CHEN WEN-CHIH   +2 more
openaire   +2 more sources

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 1998
J K L Lai
exaly  

ALLOY FOR SOLDER AND SOLDER JOINT

2004
KITAJIMA MASAYUKI, SHONO TADAAKI, HONMA HITOSHI, TAKESUE MASAKAZU, NODA YUTAKA   +4 more
openaire   +2 more sources