Results 221 to 230 of about 7,263 (261)

Automatic visual inspection of solder joints

Proceedings. 1985 IEEE International Conference on Robotics and Automation, 2005
This paper describes an approach for automatic inspection of solder joints on printed circuit boards using gray-scale images. Common defects in solder joints are recognized using features computed from segmented solder joint subimages. Unacceptable joints are assigned to one of several defective classes.
Paul J. Besl, Edward J. Delp, Ramesh C. Jain   +2 more
openaire   +1 more source

The Creep-Fatigue Interaction in Solders and Solder Joints

Journal of Electronic Packaging, 1990
Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can contribute to the so-called “creep-fatigue interaction”. The first model treats fatigue crack growth through the solder, far from the interface between solder ...
openaire   +1 more source

Impact of soldering terminal solderability of component and PCB on solder joint interface

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012
The soldering terminal solderability of component and printed circuit board (PCB) has a strong impact on the formation of solder joint interface. The good solderability of the soldering terminal will result in good interface and high reliability of solder joint.
Yuming Wang, Beibei Wang, Jian Cai, Tianxi Wang   +3 more
openaire   +1 more source

Deformation and damage of a solder–copper joint

Microelectronics Reliability, 2003
Reference LMAF-ARTICLE-2003-003doi:10.1016/S0026-2714(03)00303-2View record in Web of Science Record created on 2005-09-14, modified on 2017-05 ...
P. Tropea, Aïssa Mellal, John Botsis
openaire   +1 more source

Dynamic Mechanical Testing of Solder and Solder Joints

Circuit World, 1986
Successful use of solder joints to attach surface mounted devices to printed wiring board substrates requires knowledge of the stress‐strain properties of solder as functions of temperature, time, and loading conditions. In addition, the relatively high operating temperature of solder in comparison to its absolute melting temperature introduces a ...
openaire   +1 more source

Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2003
Damage mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored.
null Hua Ye, C. Basaran, D. Hopkins, A. Cartwright   +3 more
openaire   +1 more source

Solders and soldered joints in thermal cycling

Chemical and Petroleum Engineering, 1979
E. I. Ardashnikova, A. A. Eliseev, V. I. Sokolov   +2 more
openaire   +1 more source

Fractography of Solder Joints

Abstract Solder cracking is one of the dominant failure modes of the electronic assembly system. Experience shows that solder joints can fail due to processing defects during solder joint formation or due to excessive loading in various applications.
Qiming Zhang, Xing Qiu, Yuanjie Cheng, Jeffry C.C. Lo, S.W. Ricky Lee, Chaoran Yang, Fubin Song, Tong Jiang   +7 more
openaire   +1 more source

Solder Joint Acceptability

1988
Whether military standards are appropriate for use in commercial applications or not, they are the harbingers to industry specifications. When the IPC (Institute for Interconnecting and Packaging Electronic Circuits) rewrote its solder specification, the new spec was written with the intention of releasing it with military sanction.
openaire   +1 more source

Tensile strength of soldered joints

The Journal of Prosthetic Dentistry, 1985
T J, O'Toole, G M, Furnish, J A, von Fraunhofer   +2 more
openaire   +2 more sources