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Ultrasonic soldering, mechanical properties of solder joints
2017 40th International Spring Seminar on Electronics Technology (ISSE), 2017Mechanical properties of solder joints have influence on reliability of electronic products. Therefore the knowledge of the mechanical behavior of solder joints is very important. This article deals with comparison of mechanical properties of solder joints prepared with conventional soldering methods and ultrasonic soldering methods.
Karel Dusek +4 more
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2020
Being a joint, the mechanical properties are the basis of all solder joint characterization. The mechanical properties crucial for quality of most electronic devices include shear and pull strength, and creep properties [1].
John H. Lau, Ning-Cheng Lee
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Being a joint, the mechanical properties are the basis of all solder joint characterization. The mechanical properties crucial for quality of most electronic devices include shear and pull strength, and creep properties [1].
John H. Lau, Ning-Cheng Lee
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The Strength of Soldered Joints
Metal Science Journal, 1968AbstractThe strength of soldered joints has been measured as a function of their width and the results are compared with theoretical estimates. An explanation is given for noted deviations from theoretical predictions. Measurements have also been made of the elastic modulus of solder at high stresses. A possible relation to a ductile fracture mechanism
J. R. Griffiths, J. A. Charles
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Controlling the quality of soldering of PTH solder joints
Microelectronics Reliability, 1985The efficiency of assembly of electronic components into PCBs relies on a large number of materials and processes being carefully specified and controlled. Improved production routes for PCBs and new soldering techniques frequently appear and yet, 40 years after the first PCBs and nearly 30 years since the advent of wave soldering, the perennial ...
C. Lea, F.H. Howie
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2011
Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).
Johan Liu +5 more
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Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).
Johan Liu +5 more
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MRS Bulletin, 1993
In early electronic technologies, circuit components were attached to circuit boards by mechanical means. The electrical leads were either twisted together or mechanically interlocked to a board prior to soldering. The possibility of an unreliable solder joint causing any kind of circuit failure was remote.
D.R. Frear, F.G. Yost
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In early electronic technologies, circuit components were attached to circuit boards by mechanical means. The electrical leads were either twisted together or mechanically interlocked to a board prior to soldering. The possibility of an unreliable solder joint causing any kind of circuit failure was remote.
D.R. Frear, F.G. Yost
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Solder Joint Reliability—Can Solder Creep?
Soldering & Surface Mount Technology, 1990Solder joint long‐term reliability is an ultimate requirement for electronics packaging. Solder joint failure, however, can involve complex mechanisms. One of many basic failure processes in metals/alloys is the creep phenomenon. Creep is defined as a time‐dependent deformation when a material is subjected to a stress for a prolonged period of time ...
J.S. Hwang, R.M. Vargas
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Relationship of Soldering Profile, Voids Formation and Strength of Soldered Joints
2019 42nd International Spring Seminar on Electronics Technology (ISSE), 2019This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion Ag, immersion Sn) were used.
Steiner, František +2 more
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Stacked solder bumping technology for improved solder joint reliability
Microelectronics Reliability, 2001Abstract Solder joint failure is a serious reliability concern in flip-chip and ball grid array packages of integrated-circuit chips. In current industrial practice, the solder joints take on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that hourglass-shaped solder joints would have the lowest ...
Xingsheng Liu +3 more
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Impact of Soldering Atmosphere on Solder Joint Formation
Pan Pacific Symposium, 2008ABSTRACT The 2007 INEMI roadmap identified the increase of usage of nitrogen in the reflow and wave soldering processes due to the lower wetting forces of the lead free solders. While flux chemistries evolve and improve to promote wetting of lead free alloys, it will take many iterations to get the desired results.
Ursula Marquez de Tino +2 more
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