Results 211 to 220 of about 2,422,228 (271)

Effect of electric current stressing on mechanical performance of solders and solder joints: A review

Journal of Materials Science, 2022
Bo Wang, Wangyun Li, Shu-Ye Zhang, Xing-Min Li, K. Pan   +4 more
semanticscholar   +1 more source

Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests

Microelectronics and reliability, 2018
In this paper, the tin-lead (Sn-37wt%Pb) eutectic solder joints of plastic ball grid array (PBGA) assemblies are tested using temperature cycling, random vibrations, and combined temperature cycling and vibration loading conditions.
Tong An, Chao Fang, F. Qin, Huaicheng Li, T. Tang, Pei Chen   +5 more
semanticscholar   +1 more source

Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints

Journal of materials science. Materials in electronics, 2021
Yin-Bo Chen, Zhichao Meng, Li-Yin Gao, Zhi-Quan Liu   +3 more
semanticscholar   +1 more source

Reliability of Solder Joints

MRS Bulletin, 1993
In early electronic technologies, circuit components were attached to circuit boards by mechanical means. The electrical leads were either twisted together or mechanically interlocked to a board prior to soldering. The possibility of an unreliable solder joint causing any kind of circuit failure was remote.
D.R. Frear, F.G. Yost
openaire   +1 more source

The Strength of Soldered Joints

Metal Science Journal, 1968
AbstractThe strength of soldered joints has been measured as a function of their width and the results are compared with theoretical estimates. An explanation is given for noted deviations from theoretical predictions. Measurements have also been made of the elastic modulus of solder at high stresses. A possible relation to a ductile fracture mechanism
J. R. Griffiths, J. A. Charles
openaire   +1 more source

Ultrasonic soldering, mechanical properties of solder joints

2017 40th International Spring Seminar on Electronics Technology (ISSE), 2017
Mechanical properties of solder joints have influence on reliability of electronic products. Therefore the knowledge of the mechanical behavior of solder joints is very important. This article deals with comparison of mechanical properties of solder joints prepared with conventional soldering methods and ultrasonic soldering methods.
Karel Dusek, Martin Placek, Martin Cepek, Martin Molhanec, Ivana Beshajova Pelikanova   +4 more
openaire   +1 more source

Fractography of Solder Joints

Abstract Solder cracking is one of the dominant failure modes of the electronic assembly system. Experience shows that solder joints can fail due to processing defects during solder joint formation or due to excessive loading in various applications.
Qiming Zhang, Xing Qiu, Yuanjie Cheng, Jeffry C.C. Lo, S.W. Ricky Lee, Chaoran Yang, Fubin Song, Tong Jiang   +7 more
openaire   +1 more source

The Creep-Fatigue Interaction in Solders and Solder Joints

Journal of Electronic Packaging, 1990
Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can contribute to the so-called “creep-fatigue interaction”. The first model treats fatigue crack growth through the solder, far from the interface between solder ...
openaire   +1 more source

Solder Joint Acceptability

1988
Whether military standards are appropriate for use in commercial applications or not, they are the harbingers to industry specifications. When the IPC (Institute for Interconnecting and Packaging Electronic Circuits) rewrote its solder specification, the new spec was written with the intention of releasing it with military sanction.
openaire   +1 more source

Solders and soldered joints in thermal cycling

Chemical and Petroleum Engineering, 1979
E. I. Ardashnikova, A. A. Eliseev, V. I. Sokolov   +2 more
openaire   +1 more source