Results 1 to 10 of about 6,402 (214)

A Novel Contrastive Self-Supervised Learning Framework for Solving Data Imbalance in Solder Joint Defect Detection [PDF]

open access: yesEntropy, 2023
Poor chip solder joints can severely affect the quality of the finished printed circuit boards (PCBs). Due to the diversity of solder joint defects and the scarcity of anomaly data, it is a challenging task to automatically and accurately detect all ...
Jing Zhou   +4 more
doaj   +2 more sources

A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms

open access: yesDefence Technology
Solder joint, crucial component in electronic systems, face significant challenges when exposed to extreme conditions during applications. The solder joint reliability involving microstructure and mechanical properties will be affected by extreme ...
N Ahmad   +2 more
exaly   +3 more sources

Research on Wiener Degradation Model and Failure Mechanism of Interconnect Solder Joints Under Random Vibration Load

open access: yesIEEE Access, 2021
Electronic packaging solder joints are the key parts of mechanical fixation and electrical interconnection between electronic chips and printed circuit boards, which are prone to failure and lead to electronic device failures under the action of ...
Jiayan Dong   +3 more
doaj   +1 more source

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

open access: yesMicromachines, 2022
We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140 °C for 5 min. The wetting angle of the mixed solder joint is 17.55°. The overall atomic
Lingyao Sun   +5 more
doaj   +1 more source

The Correlation Between Cu/Sn Ratios and the Formation Speed of IMC-Cu Composite Micro Solder Joints

open access: yesJournal of Harbin University of Science and Technology, 2021
In order to study the effect of different Cu/Sn ratios on the IMC-Cu interface behavior of composite micro solder joints, this article uses a combination of Transient Liquid Phase Welding and pressure,using foamed copper, pure Sn and Cu substrates as raw
SUN Feng-lian, LI Wen-peng, PAN Zhen
doaj   +1 more source

The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

open access: yesApplied Sciences, 2020
In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated.
Peng Xue   +4 more
doaj   +1 more source

Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints

open access: yesJournal of Materials Research and Technology, 2023
Eutectic SnPb ball grid array (BGA) solder joints were exposed to 60Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0, 50, 100, 150 and 200 h in air. The effects of gamma irradiation on the microstructure evolution and mechanical properties
Qilong Guan   +8 more
doaj   +1 more source

Soldered joints of piezoelectric products

open access: yesLAPLAGE EM REVISTA, 2020
The paper considers issues related to the use of capillary luminescent flaw detection for monitoring glass-metal soldered joints of piezoelectric products. Standard methods of leakproofness testing of piezoelectric products are analysed; the framework for the applicability of each of them at the stages of the life cycle of piezoelectric products is ...
Olga E. Zheleznikova   +1 more
openaire   +3 more sources

Printed circuit board solder joint quality inspection based on lightweight classification network

open access: yesIET Cyber-systems and Robotics, 2023
Solder joint quality inspection is a crucial step in the qualification inspection of printed circuit board (PCB) components, and efficient and accurate inspection methods will greatly improve its production efficiency.
Zhicong Zhang   +4 more
doaj   +1 more source

Study on Chip Reliability Modeling Based on Mutually Dependent Competing Failure of Solder Joints in Different Failure Modes

open access: yesIEEE Access, 2020
The chip is a core functional component. Its reliability plays a vital role in electronic equipment normal operation. As the typical cause for chip malfunction, the solder joint degradation is selected to study chip reliability. The degradation models of
Longteng Li   +5 more
doaj   +1 more source

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