Results 11 to 20 of about 6,402 (214)
STUDY ON CHIP COMPONENT NO-FILLET SOLDER JOINT STRESS AND STRAIN UNDER THERMAL CYCLE
Jixie qiangdu, 2016 The chip component no-fillet solder joints finite element analysis models were set up. The influences of pad length,pad width,solder joint volume and solder joint material on the stress and strain distribution on no-fillet solder joints were analyzed ...
LIN XunChao, LIANG Ying
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Solder joint failures under thermo-mechanical loading conditions – a review [PDF]
, 2020 Solder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device.
Mallik, Sabuj +3 more
core +1 more source
Journal of Materials Research and Technology, 2023 This study investigated the fusion and phase-transformation processes of nano-intermetallic compound (nano-IMC) mixed solder pastes. In particular, the interfacial reaction with the Cu substrate, the kinetics and mechanism of Cu6Sn5 growth inside the ...
He Gao +4 more
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Dynamic properties of solders and solder joints
Journal de Physique IV (Proceedings), 2003 The high strain rate mechanical properties have been measured for three types of solder: 63% Sn 37%Pb, 96.5Sn 3.5 Ag and 95.5Sn 3.8Ag 0.7Cu. Bulk properties were measured using a split Hopkinson pressure bar (SHPB) at strain rates from 500 to 3000 s -1 . A novel method has been designed and used to measure the shear strength of solder joints at low and
Siviour, C +5 more
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Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials
Crystals, 2023 In this paper, we analyze the residual stress of different components of the crystal structures of electronic device materials following exposure to elevated temperatures using a combination of experimental tests and finite element simulations.
Ming Chen +5 more
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Experimental Study on the Melting Temperature, Microstructural and Improved Mechanical Properties of Sn58Bi/Cu Solder Alloy Reinforced with 1%, 2% and 3% Zirconia (ZrO2) Nanoparticles [PDF]
Archives of Metallurgy and Materials, 2021 This paper investigates the influence of 1%, 2% and 3% zirconia (ZrO2) nanoparticles to the melting, microstructural and mechanical properties of the Sn58Bi solder. Melting temperatures of 145.11°C, 140.89°C and 143.84°C were attained correspondingly for
S. Amares, R. Durairaj, S.H. Kuan
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Study on the reliability of nano-silver-coated tin solder joints for flip chips
Green Processing and Synthesis, 2023 The nano-silver-coated tin (Sn@Ag) paste was modeled using the method of the Anand unified viscoplastic constitutive model and elastic model. After thermal cyclic loading, the plastic strain of the solder joints increased cumulatively, while the maximum ...
Yang Hui, Chen Wenhui
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Materials Research Express, 2020 The effect of Cu particles size and bonding time on the microstructure and shear property of Cu/In-45Cu/Cu solder joint was studied, and the shedding mechanism of intermetallic compounds (IMCs) in the solder joint during transient liquid phase (TLP ...
Li Yang +4 more
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Crystals, 2021 In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were
Lu Liu +4 more
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Journal of Materials Research and Technology, 2023 The preparation of new solder joint materials for chip packaging by designing a variety of brazing material mixes has become one of the future research directions for solder joints. They added low melting point elements to traditional solder materials to
Shuye Zhang +6 more
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