Results 21 to 30 of about 6,402 (214)

OPTIMIZATION OF HOT AIR SOLDER LEVELING (HASL) MACHINE FOR A ROBUST SURFACE FINISH IN SOLDERING APPLICATIONS [PDF]

European Journal of Materials Science and Engineering, 2023
Hot Air Solder Leveling (HASL) is one of the most commonly used surface finishes in the industry. HASL is also one of the least expensive types of PCB surface finishes available. This study aims to examine the influence on the solder joint microstructure
Mohd Izrul Izwan RAMLI, Siti Farahnabilah MUHD AMLI, Norainiza SAUD, Dewi Suriyani CHE HALIN, Nur Akrimi Maswa MD FAUZI   +4 more
doaj   +1 more source

Effect of gamma irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Journal of Materials Research and Technology, 2023
Sn3Ag0.5Cu (SAC305) Ball Grid Array (BGA) solder joints were exposed to 60Co source gamma irradiation at a dose rate of 1 Gy(Si)/s from 0 to 200 h in air.
Qilong Guan, Chunjin Hang, Gang Yao, Shengli Li, Dan Yu, Ying Ding, Yanhong Tian   +6 more
doaj   +1 more source

The Performance of Resistance to Hot and Cold Cycle of A New Lead-Free Solder Paste

Journal of Harbin University of Science and Technology, 2018
The performance of resistance to hot and cold cycle of a new low silver solder paste SnAgCuBiNi (SACBN07) and SAC305 solder paste on the market were compared and analyzed.
ZHANG Qi, SUN Feng-lian
doaj   +1 more source

The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint

Metals, 2021
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength of a Zn-added Sn-0.7Cu solder ...
Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, Rita Mohd Said, Mohd Mustafa Al Bakri Abdullah, Dewi Suriyani Che Halin, Norainiza Saud, Marcin Nabiałek   +6 more
doaj   +1 more source

Sensitivity Analysis for the Dependence of Solder Joints Fatigue Life

Chemical Engineering Transactions, 2013
In electronic package technology, solder joint is not only used for the electrical connection and mechanical connection, but also offering the channel of heat dissipation.
W. Hu, C. Liu, Y. Sun, G. Zhao
doaj   +1 more source

Effect of Cr Addition on Microstructure and Properties of AuGa Solder

Metals, 2020
In order to meet the service requirements of electronic devices working at 300 °C in the fields of energy resource prospecting and space exploration, Cr element was added to modify AuGa solder to improve its high-temperature performance.
Yu Tao, Songbai Xue, Han Liu, Weimin Long, Bo Wang   +4 more
doaj   +1 more source

Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength

Nanomaterials, 2019
In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical ...
Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, Michael Weser, Wael G. Al-Kouz, Maen S. Sari, Ibrahim Alhoweml   +6 more
doaj   +1 more source

Microstructure and Properties of Electromigration of Sn58Bi/Cu Solder Joints with Different Joule Thermal Properties

Metals, 2023
Electromigration is one of the most important research issues affecting the reliability of solder joints. Current-induced Joule heating affects the electromigration behavior of solder joints.
Yijie Gao, Keke Zhang, Chao Zhang, Yuming Wang, Weiming Chen   +4 more
doaj   +1 more source

Microstructures, mechanical properties and reliability induced from size effect in Sn-based solder joints: Review

Journal of Materials Research and Technology
With the continuous advancement of integrated packaging technology, the dimensions of Sn-based interconnected joints are being steadily reduced. It is necessary to investigate the dependability of Sn-based solder joints with various size since the change
Sijin Li, Xiaowei Wang, Mingqing Liao, Zezheng Li, Qi Li, Han Yan, Aidong Liu, Fengjiang Wang   +7 more
doaj   +1 more source

Effects

Journal of King Saud University: Engineering Sciences, 2015
In this study, the effects of crosshead speeds on solder strength of Cu/Sn–9Zn/Cu lap joints were determined. The solder strength of lap joints increased with increasing crosshead speeds.
Muhammad Ghaddafy Affendy, Ahmad Azmin Mohamad   +1 more
doaj   +1 more source