Results 31 to 40 of about 6,402 (214)

Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

Nanomaterials, 2020
This study aims to evaluate solder joint reliability under high speed impact tests using nanoindentation properties of intermetallic compounds (IMCs) at the joint interface. Sn–Ag based solder joints with different kinds of interfacial IMCs were obtained
Jenn-Ming Song, Bo-Chang Huang, David Tarng, Chih-Pin Hung, Kiyokazu Yasuda   +4 more
doaj   +1 more source

Experimental studies on application of silver paste in thermosonic flip-chip bonding

Journal of Low Frequency Noise, Vibration and Active Control, 2023
In this subject, thermosonic flip-chip technology was introduced to conduct low-temperature bonding of Ag paste and chip interconnection experiments with micro solder joints.
Hui Yang, Zhengbang Zhan
doaj   +1 more source

Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]

, 2021
Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
core  

A damage integral approach to solder joint fatigue

, 1990
The application of a damage integral approach which provides numerical accounting of the accumulated fatigue damage in solder joint is reviewed. The instantaneous fatigue damage rate is determined by the solder stress state, temperature and environment ...
R. Subrahmanyan, C.-Y. Li, Li, C.-Y., McGroarty, J., J. McGroarty, Subrahmanyan, R.   +5 more
core   +1 more source

Gallium-effect in a lead-free solder for silver-sheathed superconducting tape

Materials Research Express, 2021
Solder joints of silver-sheathed superconducting tapes are promising for various commercial applications. In this research, Pb, Ga, and Ga-doped lead-free Sn–Ag–Cu solders are used to study the gallium effect for the low joint resistivity with silver ...
Shin-Ichi Shamoto, Min Kai Lee, Yuki Fujimura, Keietsu Kondo, Takashi U Ito, Kazuhiko Ikeuchi, Satoshi Yasuda, Lieh-Jeng Chang   +7 more
doaj   +1 more source

Microstructure and mechanical performance of dissimilar material joints of 2024Al and SiO2 glass by ultrasonic assisted soldering with Cu interlayer

Journal of Materials Research and Technology, 2022
Ultrasonic assisted soldering was used to join SiO2 glass and 2024Al with Sn solder. The soldering temperature and pressure were set at 300 °C and 0.2 MPa respectively. The Sn solder had good wettability on the SiO2 glass surface by ultrasonic cavitation.
Haijun Li, Ruixiang Yi, Chao Chen
doaj   +1 more source

Effect of electron irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

Journal of Materials Research and Technology
Power electronic devices face harsh radiation environments in deep space exploration. It is significant to study the reliability of solder joints of electronic devices in radiation environments.
Yang Liu, Yangjing Xia, Yuxiong Xue, Xuewei Zhao, Nannan Li, Zhengqiang Zhu, Chaoyang Xing   +6 more
doaj   +1 more source

Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]

, 2004
Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
core  

The combined effect of reflow soldering time and Bi doping on the interfacial behavior and shear properties of Sn-0.7Cu-0.8Zn/Cu solders joint

Journal of Materials Research and Technology
The interfacial intermetallic compounds (IMC) layers evolution and shear properties in Sn-0.7Cu-0.8Zn/Cu and Sn-0.7Cu-0.8Zn–5Bi/Cu solder joint at different reflow soldering time were investigated.
Wenbin Tu, Shanlin Wang, Weihua Chen, Pengfei Wang, Jilin Xie, Si Chen, Min Zheng, Mingwei Wei, Yuhua Chen, Fan Wu   +9 more
doaj   +1 more source

Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying Hot-Bar Lift-Up Time and Adding Silica Fillers

Metals, 2018
Micron sizes solder metallurgical joints have been applied in a thin film application of anisotropic conductive film and benefited three general advantages, such as lower joint resistance, higher power handling capability, and reliability, when compared ...
Shuye Zhang, Ming Yang, Mingliang Jin, Wen-Can Huang, Tiesong Lin, Peng He, Panpan Lin, Kyung-Wook Paik   +7 more
doaj   +1 more source