Results 51 to 60 of about 6,402 (214)

Creep-caused fracture of PbSn solder joint

, 2017
This paper analyzes two failure cases of creep-caused fracture of PbSn solder joint, including the joint between the wire and solder cup in the connector and the joint between the integrated circuit (IC) pins and the printed circuit board (PCB).
Z. B. Wang, X. Wang, Y. Chen, M. Meng
core   +1 more source

Research on Target Detection Algorithm for Solder Joint Defects Based on the Improved YOLOv8

IEEE Access
Aiming at the problem of low accuracy in solder joint defect detection caused by the complex background and difficult to extract defect features of circuit boards using through-hole technology (THT), an improved YOLOv8 solder joint defect target ...
Chengkai Zhang, Xiaocui Feng, Pujun Mao, Fuyan Lv   +3 more
doaj   +1 more source

Constitutive behaviour and life evaluation of solder joint under the multi-field loadings

AIP Advances, 2018
The mechanical behaviour and service life of the 63Sn-37Pb solder joint under coupled thermal-electrical loadings have been investigated. The mechanical properties of solder material are calibrated by uniaxial tensile experiments at different strain ...
Xu Long, Yongchao Liu, Yao Yao, Fengrui Jia, Cheng Zhou, Yonghui Fu, Yanpei Wu   +6 more
doaj   +1 more source

Study on the reliability of novel Au–30Ga solder for high-temperature packaging

Journal of Materials Research and Technology, 2020
As a novel high-temperature solder with suitable eutectic temperature and excellent solderability, Au–30Ga eutectic alloy shows high application potential as a packaging material for high-power devices.
Han Liu, Songbai Xue, Yu Tao, Weimin Long, Sujuan Zhong, Bo Wang   +5 more
doaj   +1 more source

Analysis of surface mount technology solder joints

, 1996
This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee, Hui, I.K.
core  

Voids in Solder Joints

Journal of Surface Mount Technology, 2006
ABSTRACT Recently, voids in solder joints has been a hot topic of discussion within the electronics manufacturing industry. The main interest stems from the impact that these voids have on the long term reliability of solder joints. But, not all solder joints voids are the same.
openaire   +1 more source

Influence of Humidity on Voids Formation Inside the Solder Joint

, 2013
Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on voids formation inside the solder joint
Žák, P., Dušek, K., Vlach, J., Brejcha, M., Hájková, L.   +4 more
core  

Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process

, 2022
Solder joint reliability has become an increasingly important factor in electronic industries to obtain sustainable and reliable electronic packages. The simulation study of 3D finite elements on BGA test assembly models with geometries of SMD-NSMD and ...
Sujan Debnath, Lau Hong Ming, Mohamad Shahrul Effendy Kosnan, Siti Faizah Mad Asasaari, Mohd Al Fatihhi Szali Januddi, Mahzan Johar   +5 more
core  

Vision-based classification of solder joint defects

, 2010
Inspection of solder joints has been a critical process in the electronic manufacturing industry to reduce manufacturing cost, improve yield, and ensure product quality and reliability.
Mar, Nang Seng Siri
core  

Bonding through novel solder-metallic mesh composite design

Materials & Design, 2018
Thin metallic Cu and Ni meshes were successfully embedded within SAC305 solder joints. Defects (residues) within the joint were removed by a vacuum step in the bonding sequence.
Adrian Lis, Hiroaki Tatsumi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose   +5 more
doaj   +1 more source