FINITE ELEMENT ANALYSIS ON THE EFFECT OF SOLDER JOINT GEOMETRY FOR THE RELIABILITY OF BALL GRID ARRAY ASSEMBLY WITH FLEXIBLE AND RIGID PCBS [PDF]
Journal of Engineering Science and Technology, 2014 In the present study, three-dimensional (3D) finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible and rigid PCBs ...
CHUN-SEAN LAU +3 more
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Study on Novel Water-Based Polymer Surface Treatment Agent for Solder Ball and Its Performance [PDF]
Cailiao BaohuIn order to solve the problem of solder balls being prone to oxidation during long-term storage and transportation, a novel water-based polymer surface treatment agent for solder balls was prepared and researched, with solder balls of Sn3.0Ag0.5Cu ...
WANG Tongju, LIN Zipeng, ZHANG Wenqian, LEI Yongping, WU Yuting, LIU Yahao, LENG Qishun
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Thermal-mechanical interface crack behaviour of a surface mount solder joint
, 1998 The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis.
吴永礼 +3 more
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Prediction of mechanical properties and fatigue life of nanosilver slurry in chip interconnection
AIP AdvancesThis article investigates the failure mode and mechanism of copper pillar solder joints in temperature cycling experiments, focusing on a Cu/nano Ag/Cu solder joint structure.
Hui Yang, Shuai Cheng
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Research on Lifespan Prediction Methods Using Ultrasonic Microimaging for Electronic Packaging
Applied SciencesAddressing the issue of lifespan prediction for electronic packages under thermal loading, this paper proposes a method for predicting the lifespan of electronic packages based on ultrasonic microimaging.
Haotian Wang +4 more
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Automatic solder joint defect classification using the Log-Gabor filter
, 2010 This paper proposes the validity of a Gabor filter bank for feature extraction of solder joint images on Printed Circuit Boards (PCBs). A distance measure based on the Mahalanobis Cosine metric is also presented for classification of five different types
Yarlagadda, Prasad K. +2 more
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Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint
, 2009 Purpose: The purpose of this paper is to fit Coffin-Manson equation of Sn-4.0Ag-0.5Cu lead free solder joint by using results of solders joint reliability test and finite element analysis. Also to present a novel device for solder joint reliability test.
Liu, Johan, +9 more
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Solder Joint Reliability Prediction
, 2015 The thesis deals issue of the solder joint reliability and diagnostics. The manufacturing technology of electronics currently features a very high level of perfection.
Stejskal, Petr
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Solder Joint Electric Conductivity and Solder Joint Reliability
, 2010 This work is considered about changes of electric conductivity in lead-free soldered joint's affected by current and thermal stress. The theoretical part describes factors influencing the solder joint electric conductivity and solder joint reliability ...
Lačný, Radek
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Joint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures. [PDF]
, 2007 Soldering is used extensively in the electronic industry. It used to connect printed circuit board to join the circuit between electronic parts. The quality and reliability of electronic products strongly depend on those of solder joints.
Ariff Syakirin, Ghazalli
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