Results 81 to 90 of about 6,402 (214)

Effect of Zn Addition to Sn-3Ag-5Bi Solder on Joint Strength and Joint Interface

The mechanical properties and the joint strength of Sn-Ag-Bi solders as replacement solders for Sn-Pb eutectic solder were investigated. The joint strength between Cu sheets and solder decreases when more than 5 mass% Bi is added to Sn-Ag system solders ...
Ninomiya, Ryuuji, Nakahara, Yuunosuke, Tagami, Michihiro   +2 more
core   +2 more sources

Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis. [PDF]

Materials (Basel), 2023
Amli SFM, Salleh MAAM, Aziz MSA, Yasuda H, Nogita K, Abdullah MMAB, Nemes O, Sandu AV, Vizureanu P.   +8 more
europepmc   +1 more source

The Modeling and Prediction Study of BLP Device Solder Joint Three-Dimensional Shape

, 2011
Solder joint shape refers to geometry that molten solder can be achieved with spreading and wetting along the metal surface in the junction between components solder pins and printed circuit board (PCB) pad, to the metal surface contact angle and solder ...
Zhao Hua Wu
core   +1 more source

A Study of Solder Joint Failure Criteria

, 2011
One of the challenges in an experimental study of solder joint reliability is to determine when cracks occur in a solder joint or when a solder joint fails. Cracks in a real solder joint are difficult to identify using an X-Ray system.
Pan, Jianbiao, Silk, Julie
core  

Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint. [PDF]

Materials (Basel), 2022
Zhang S, Wang Z, Wang J, Duan G, Li H.
europepmc   +1 more source

Solder Joint Failure Modes in the Conventional Crystalline Si Module

, 2014
In the conventional PV module system based on crystalline Si solar cell, solder joint has been used for electrical connection in the four positions such as (1) Cu ribbon interconnection on Ag electrode of Si solar cell, (2) electrical connection of Cu ...
Takeuchi, Kohichi, Yoshida, Manabu, Takemura, Yasuyuki, Itoh, Uichi, Tokuhisa, Hideo   +4 more
core   +1 more source

Interfacial reactions between Sn–Ag lead-free solders and polycrystalline and single-crystal copper

Journal of Materials Research and Technology
With the trend of solder joint miniaturization, the proportion of interfacial intermetallic compounds in the overall solder joint structure has increased, making interfacial reactions and microstructures key factors that restrict solder joint performance.
Jing Han, Hongjin Zhou, Zixuan Li, Chenxi Zhao, Zhenya Zhang, Guangming Zhang, Fu Guo   +6 more
doaj   +1 more source

Effect of heat shield locations on rework-induced thermal management in ball grid array solder joint. [PDF]

Sci Rep, 2022
Ismail AA, Bakar MA, Ehsan AA, Jalar A, Burke J, Zolkefli ZE, Basiron E.   +6 more
europepmc   +1 more source

Mechanical Properties of solder joint

, 2010
This thesis deals with the differences between the mechanical properties of surface conditionings of the printed circuit boards and various types of soldering pastes.
Meliš, Josef
core  

Numerical modelling of solder joint formation

, 1998
Solder materials are used to provide a connection between electronic components and printed circuit boards (PCBs) using either the reflow or wave soldering process.
Bailey, Chris, Cross, Mark, Wheeler, Daniel   +2 more
core   +1 more source