Results 91 to 100 of about 6,402 (214)

Reliability optimization of solder joints in large-sized COTS devices based on solder mask layer design

Hanjie xuebao
High reliability application fields often require specialized devices, which have slower iteration updates and higher costs. COTS devices have a fast update speed and good quality consistency, but their applicability and reliability in specialized fields
Geng LI, Shang WANG, Yuxin SUN, Junhao MENG, Wenzhi WU, Yanhong TIAN   +5 more
doaj   +1 more source

Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materials

Materials & Design
Thermal fatigue tests of semiconductor packages were conducted varying solder materials such as SAC305 and SAC302 with Bi, Ni, and Pd (named hybrid solder ball, HSB) and number of chips inside the package at temperatures ranging from 0 °C to 120°.
Heon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, Hak-Sung Kim   +5 more
doaj   +1 more source

Thermal Induced Interface Mechanical Response Analysis of SMT Lead-Free Solder Joint and Its Adaptive Optimization. [PDF]

Micromachines (Basel), 2022
Liu S, Yan Y, Zhou Y, Han B, Wang B, Zhang D, Xue S, Wang Z, Yu K, Shi Y, Wang C.   +10 more
europepmc   +1 more source

Solder Joint Conductivity - Influence of Solder Volume and Isothermal Aging

, 2012
The master thesis analyses electrical conductivity of lead-free solder joints. The test method design for monitoring the electrical conductivity of the soldered joint is described in the practical part.
Mach, Ladislav
core  

Assembly stiffness and failure criterion considerations in solder joint fatigue

, 1990
The ramifications of the definition of failure on solder joint fatigue life are discussed in terms of two considerations: (1) the dependence of the measured damage parameter (load drop or resistance increase) on the solder joint area and (2) the time ...
Wilcox, J. R., Li, Che-Yu, Subrahmanyan, R.   +2 more
core   +1 more source

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint. [PDF]

Materials (Basel), 2021
Hashim AN, Salleh MAAM, Sandu AV, Ramli MM, Yee KC, Mohd Mokhtar NZ, Chaiprapa J.   +6 more
europepmc   +1 more source

Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models. [PDF]

Materials (Basel), 2021
Yuan C, Fan X, Zhang G.
europepmc   +1 more source

Investigation of the Lead-free Solder Joint Shear Performance

, 2006
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance ...
Webster, James, Brian J. Toleno, Jianbiao Pan, Pan, Jianbiao, James Webster, Toleno, Brian J.   +5 more
core   +1 more source

STUDY OF ELECTROMIGRATION FAILURE MECHANISM IN MICRO SOLDER JOINT

, 2021
The miniaturizing trend for advanced electronic devices has motivated the microelectronic industries to pursue device integration and packaging technology based on the micro-bump solder joint.
Madanipour, Hossein
core  

Thermomechanical Stress of Lead Free Solder Joint

, 2011
This diploma thesis deals with the reliability of lead-free solder joints at a different interconnection structures. The first goal is to design the test cases shape BGA (FC) for testing the strength of lead-free solder joints at shear test in link with ...
Libich, Jiří
core   +1 more source