Results 101 to 110 of about 6,402 (214)
Solder joint technology: materials, properties, and reliability
, 2007 Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006.
Tu, King-Ning
core
On the plasticity of the solder joint.
, 1993 On the plasticity of the solder ...
Andrew Frederick. Skipor (7988939)
core
Prediction of Solder Joint Geometries in Array-Type Interconnects
, 1996 An approximate mathematical model is developed for predicting the shapes of solder joints in an array-type interconnect (e.g., a ball-grid array or flip-chip interconnect).
Heinrich, Stephen M. +3 more
core +1 more source
Interfacial microstructure and joint strength of Sn-3.5Ag-X (X = Cu, In, Ni) solder joint
, 2002 Interfacial phase and microstructure, solder hardness. and joint strength of Sn-3.5Ag-X (X = Cu. In, Ni; compositions are all in wt% unless specified otherwise) solder alloys were investigated.
Jeong, SW +3 more
core
Analysis of solder joint changes caused by aging
, 2011 These thesis deals with electromigration in solder joint. In theoretical part are described lead-free solders, surface finish, formation of solder joint, intermetallic compounds a electromigration.
Paško, Martin
core
Study on Establishing Degradation Model of Chip Solder Joint Material under Coupled Stress. [PDF]
Materials (Basel), 2020 Li L, Jing B, Hu J.
europepmc +1 more source
Non-destructive evaluation of solder joint reliability
, 2012 A through life non-destructive evaluation technique is presented in which a key solder joint feature, nucleating at the bump to silicon interface and propagating across a laminar crack plane is captured and tracked using acoustic microscopy imaging (AMI).
Braden, Derek Richard
core
Reliability of Substrate Solder Joints from Power Cycling Tests
Kongzhi Yu Xinxi Jishu, 2010 The lifetime of the solder joint between base plate and ceramic substrate is usually tested by passively heating and cooling the IGBT module (thermal cycling). This provokes failures (delamination) in that solder layer.
Thomas Hunger, 德国
doaj
Failure Behavior and Mechanism of Solder Joint Under Thermal Mechanical Coupling Loads. [PDF]
Materials (Basel)Deng Y +6 more
europepmc +1 more source