Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding. [PDF]
Materials (Basel)Li W +7 more
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Imaging the Polymorphic Transformation in a Single Cu₆Sn₅ Grain in a Solder Joint. [PDF]
Materials (Basel), 2018 Somidin F +6 more
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Solder Joint Quality based on Heating Factor
, 2017 Master’s thesis in the theoretical part analyses the heating factor (Q), which has significant share on quality of a solder joint. The practical part describes the design and production of test PCB and setting temperature profiles, SMD resistors ...
Kučírek, Martin
core
A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced Packaging. [PDF]
Materials (Basel)Su Q, Yuan C, Chiang KN.
europepmc +1 more source
Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature. [PDF]
Materials (Basel)He S +6 more
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Numerical study of solder joint failure under fast loading conditions
, 2010 A numerical study was undertaken to investigate the solder joint failure under fast loading conditions. The finite element model assumes a lap-shear testing configuration, where the solder joint is bonded to two copper substrates.
Aluru, Kiranmaye
core
First-principles study on elastic properties of Cu, (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn and interfacial mechanical properties of (Cu<sub>1-</sub> <i><sub>x</sub></i> ,Ni <i><sub>x</sub></i> )<sub>3</sub>Sn/Cu in the lead-free solder joint. [PDF]
Beilstein J NanotechnolHua G.
europepmc +1 more source
Non-destructive evaluation of solder joint reliability
A through life non-destructive evaluation technique is presented in which a key solder joint feature, nucleating at the bump to silicon interface and propagating across a laminar crack plane is captured and tracked using acoustic microscopy imaging (AMI).
Braden, D R
core
Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering. [PDF]
Materials (Basel)Kang D +6 more
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