Multi-Target Radar Speed Meter Failure Mechanism Research. [PDF]
Luo L +6 more
europepmc +1 more source
Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging. [PDF]
Lin P +5 more
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Progress and Challenges in Joining for Precision Endoscope Fabrication. [PDF]
Xu P, Zheng X, Li L, Wang Z.
europepmc +1 more source
A method for recognizing positive and negative electrodes of buzzer circuit board based on machine vision. [PDF]
Liu X +6 more
europepmc +1 more source
Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc +1 more source
Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. [PDF]
Liu J, Saad AA, Zheng Y, Ji H, Bachok Z.
europepmc +1 more source
A SMT pin soldering defect detection system based on improved connectivity domain algorithm. [PDF]
Xiong W, Xiao N, Wang R.
europepmc +1 more source
Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints. [PDF]
Kim J +4 more
europepmc +1 more source
Cross Comparison Between Thermal Cycling and High Temperature Stress on I/O Connection Elements. [PDF]
Dhyani M +3 more
europepmc +1 more source
Study on warpage stress in SiP packages during reflow soldering. [PDF]
Qu RN +5 more
europepmc +1 more source

