Results 131 to 140 of about 6,402 (214)

Multi-Target Radar Speed Meter Failure Mechanism Research. [PDF]

Sensors (Basel)
Luo L, Jiang X, Shao J, Chen C, Zhao C, Zhang X, Shen X.   +6 more
europepmc   +1 more source

Low-Temperature Sintering Mechanism and Bonding Performance of Submicron Triangular Silver Paste for Advanced Electronic Packaging. [PDF]

Materials (Basel)
Lin P, Tong Z, Xu S, Wang Y, Wang S, Tian Y.   +5 more
europepmc   +1 more source

Progress and Challenges in Joining for Precision Endoscope Fabrication. [PDF]

Sensors (Basel)
Xu P, Zheng X, Li L, Wang Z.
europepmc   +1 more source

A method for recognizing positive and negative electrodes of buzzer circuit board based on machine vision. [PDF]

PLoS One
Liu X, Wang C, Huang X, Sun C, Zhu R, Hu C, Ding Q.   +6 more
europepmc   +1 more source

Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]

J Mater Sci
Hsieh CL, Coyle RJ, Xian JW, Gourlay CM.
europepmc   +1 more source

Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. [PDF]

Materials (Basel)
Liu J, Saad AA, Zheng Y, Ji H, Bachok Z.
europepmc   +1 more source

A SMT pin soldering defect detection system based on improved connectivity domain algorithm. [PDF]

Sci Rep
Xiong W, Xiao N, Wang R.
europepmc   +1 more source

Non-destructive orientation tracking of individual β-Sn grains in die-attach solder joints. [PDF]

J Synchrotron Radiat
Kim J, Hayashi Y, Tatsumi H, Nishikawa H, Yabashi M.   +4 more
europepmc   +1 more source

Cross Comparison Between Thermal Cycling and High Temperature Stress on I/O Connection Elements. [PDF]

Micromachines (Basel)
Dhyani M, Avraham T, Bernstein JB, Bender E.   +3 more
europepmc   +1 more source

Study on warpage stress in SiP packages during reflow soldering. [PDF]

Sci Rep
Qu RN, Li DS, Pan L, Xin J, Qi W, Qin QH.   +5 more
europepmc   +1 more source