Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints. [PDF]
Materials (Basel)Wang CH, Li CA, Li KT, Chiu HW.
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Microstructural Characterisation of Bi-Ag-Ti Solder Alloy and Evaluation of Wettability on Ceramic and Composite Substrates Joined via Indirect Electron Beam Heating in Vacuum. [PDF]
Materials (Basel)Sloboda M +6 more
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Cerium as corrosion inhibitor for Sn-3Ag-0.5Cu solder alloy in 3.5% NaCl solution. [PDF]
Sci RepVani R, Kumar G, Sharma S, Hegde A.
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Heterogeneous integration of micro-LEDs via multiple simultaneous transfer and bonding. [PDF]
Microsyst NanoengJoo J +9 more
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Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight. [PDF]
Materials (Basel)Zhang X, Gao J, Zhang L.
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Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits. [PDF]
Materials (Basel)Liang C +7 more
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Electromigration in solder joints and solder lines
JOM, 2002Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure.
H. Gan, W. J. Choi, G. Xu, K. N. Tu
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Solder joints on rustless alloys
The Journal of the American Dental Association, 1959Passivation is a method of restoring the continuity of the oxide film on metal surfaces in order to reduce corrosion. Nickelchromium alloys should be chemically or electrically passivated before these alloys are soldered. Wherever possible, soldered nickel-chromium alloys should be scrubbed mechanically, dried and set aside to be passivated ...
S M, BIEN, H D, AYERS
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Preceramic and postceramic solder joints
The Journal of Prosthetic Dentistry, 1975This investigation evaluated preceramic and postceramic soldering procedures. Three gap spaces and two soldering methods were evaluated. Wider gaps produced stronger joints. The strongest joints were achieved by using wider gaps and the oven soldering technique.
E H, Stade, M H, Reisbick, J D, Preston
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