Results 161 to 170 of about 6,402 (214)
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Automatic solder joint inspection
IEEE Transactions on Pattern Analysis and Machine Intelligence, 1988The task of automating the visual inspection of pin-in-hole solder joints is addressed. Two approaches are explored: statistical pattern recognition and expert systems. An objective dimensionality-reduction method is used to enhance the performance of traditional statistical pattern recognition approaches by decorrelating feature data, generating ...
Sandra L. Bartlett +5 more
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International Symposium on Microelectronics, 2012
Solder joint arrays were tested under tensile loading to determine the strain-to-failure (ductility) under a wide range of conditions. The trends in ductility with alloy, joint size, pad metallization, and test conditions were quantified and discussed. 63Sn37Pb solder joints showed a significant increase in ductility as applied stress is reduced below ...
Robert Darveaux +2 more
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Solder joint arrays were tested under tensile loading to determine the strain-to-failure (ductility) under a wide range of conditions. The trends in ductility with alloy, joint size, pad metallization, and test conditions were quantified and discussed. 63Sn37Pb solder joints showed a significant increase in ductility as applied stress is reduced below ...
Robert Darveaux +2 more
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Thermomigration in solder joints
Materials Science and Engineering: R: Reports, 2012Abstract In 3D IC technology, the vertical interconnection consists of through-Si-vias (TSV) and micro solder bumps. The size of the micro-bump is approaching 10 μm, which is the diameter of TSV. Since joule heating is expected to be the most serious issue in 3D IC, heat flux must be conducted away by temperature gradient.
Chih Chen +4 more
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Ultrasonic soldering, mechanical properties of solder joints
2017 40th International Spring Seminar on Electronics Technology (ISSE), 2017Mechanical properties of solder joints have influence on reliability of electronic products. Therefore the knowledge of the mechanical behavior of solder joints is very important. This article deals with comparison of mechanical properties of solder joints prepared with conventional soldering methods and ultrasonic soldering methods.
Karel Dusek +4 more
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2020
Being a joint, the mechanical properties are the basis of all solder joint characterization. The mechanical properties crucial for quality of most electronic devices include shear and pull strength, and creep properties [1].
John H. Lau, Ning-Cheng Lee
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Being a joint, the mechanical properties are the basis of all solder joint characterization. The mechanical properties crucial for quality of most electronic devices include shear and pull strength, and creep properties [1].
John H. Lau, Ning-Cheng Lee
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The Strength of Soldered Joints
Metal Science Journal, 1968AbstractThe strength of soldered joints has been measured as a function of their width and the results are compared with theoretical estimates. An explanation is given for noted deviations from theoretical predictions. Measurements have also been made of the elastic modulus of solder at high stresses. A possible relation to a ductile fracture mechanism
J. R. Griffiths, J. A. Charles
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Controlling the quality of soldering of PTH solder joints
Microelectronics Reliability, 1985The efficiency of assembly of electronic components into PCBs relies on a large number of materials and processes being carefully specified and controlled. Improved production routes for PCBs and new soldering techniques frequently appear and yet, 40 years after the first PCBs and nearly 30 years since the advent of wave soldering, the perennial ...
C. Lea, F.H. Howie
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2011
Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).
Johan Liu +5 more
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Solder joint reliability is the ability of solder joints to function under given conditions and to remain in conformance to both mechanical and electrical specifications for a specified period of time (without failing within the intended operating time).
Johan Liu +5 more
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MRS Bulletin, 1993
In early electronic technologies, circuit components were attached to circuit boards by mechanical means. The electrical leads were either twisted together or mechanically interlocked to a board prior to soldering. The possibility of an unreliable solder joint causing any kind of circuit failure was remote.
D.R. Frear, F.G. Yost
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In early electronic technologies, circuit components were attached to circuit boards by mechanical means. The electrical leads were either twisted together or mechanically interlocked to a board prior to soldering. The possibility of an unreliable solder joint causing any kind of circuit failure was remote.
D.R. Frear, F.G. Yost
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Solder Joint Reliability—Can Solder Creep?
Soldering & Surface Mount Technology, 1990Solder joint long‐term reliability is an ultimate requirement for electronics packaging. Solder joint failure, however, can involve complex mechanisms. One of many basic failure processes in metals/alloys is the creep phenomenon. Creep is defined as a time‐dependent deformation when a material is subjected to a stress for a prolonged period of time ...
J.S. Hwang, R.M. Vargas
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