Results 181 to 190 of about 6,402 (214)
Some of the next articles are maybe not open access.
Abstract Solder cracking is one of the dominant failure modes of the electronic assembly system. Experience shows that solder joints can fail due to processing defects during solder joint formation or due to excessive loading in various applications.
Qiming Zhang +7 more
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Qiming Zhang +7 more
openaire +1 more source
1988
Whether military standards are appropriate for use in commercial applications or not, they are the harbingers to industry specifications. When the IPC (Institute for Interconnecting and Packaging Electronic Circuits) rewrote its solder specification, the new spec was written with the intention of releasing it with military sanction.
openaire +1 more source
Whether military standards are appropriate for use in commercial applications or not, they are the harbingers to industry specifications. When the IPC (Institute for Interconnecting and Packaging Electronic Circuits) rewrote its solder specification, the new spec was written with the intention of releasing it with military sanction.
openaire +1 more source
Tensile strength of soldered joints
The Journal of Prosthetic Dentistry, 1985T J, O'Toole +2 more
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The effects of solder joint height on the solid–liquid interface diffusion in micro solder joints
Materials Letters, 2022Xuemei Li, Xiangwei Li, Fenglian Sun
exaly
Abstract This chapter focuses on factors that influence the mechanical properties of a soldered joint, including solder material, base material, solder joint design, soldering surface, soldering temperature, and test methodology.
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SOLDERABILITY - THE KEY TO SOLDER JOINT RELIABILITY
Symposium on Deep Submergence Propulsion and Marine Systems, 1966openaire +1 more source
Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes
Nanomaterials and Nanotechnology, 2021Norliza Ismail +2 more
exaly
Electromigration in Solder Joints
Journal of The Japan Institute of Electronics Packaging, 2020openaire +1 more source