Results 191 to 200 of about 6,402 (214)

TEM observation of interfaces in a solder joint in a semiconductor device

Science and Technology of Advanced Materials, 2002
Hiroyasu Saka
exaly  

IC Solder Joint Inspection Based on an Adaptive-Template Method

IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018
Qian Ye, Nian Cai, Feiyang Li
exaly  

IC solder joint inspection based on the Gaussian mixture model

Soldering and Surface Mount Technology, 2016
Nian Cai, Qian Ye, Zhijing Yang
exaly  

Effects of coupled stressing and solid-state aging on the mechanical properties of Sn–58Bi–0.7Zn solder joint

Journal of Materials Science: Materials in Electronics, 2015
Ping Wu
exaly  

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

Thin Solid Films, 2004
J H L Pang, T H Low, B S Xiong
exaly  

Deformation of solder joint under current stressing and numerical simulation––I

International Journal of Solids and Structures, 2004
Cemal Basaran, Douglas C Hopkins
exaly  

Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn–3.5Ag–0.7Cu solder joint

Journal of Alloys and Compounds, 2008
Jeong-Won Yoon, Seung-Boo Jung
exaly  

Asymmetrical solder microstructure in Ni/Sn/Cu solder joint

Scripta Materialia, 2006
C Y Liu
exaly  

Solder joint inspection using eigensolder features

Soldering and Surface Mount Technology, 2018
Hao Wu, Xiangrong Xu
exaly  

In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects

Journal of Materials Science and Technology
Jinhong Liu, Shuye Zhang
exaly