Results 171 to 180 of about 6,402 (214)

Relationship of Soldering Profile, Voids Formation and Strength of Soldered Joints

2019 42nd International Spring Seminar on Electronics Technology (ISSE), 2019
This paper deals with relationship of soldering profile, void formation and mechanical strength of resulted solder joints. An experiment was design for this purpose. For the experiment, four solder paste (BiSnAg, SAC305, Sn100C, SnSb) and three surface finishes of PCB (ENIG, immersion Ag, immersion Sn) were used.
Steiner, František, Wirth, Václav, Hirman, Martin   +2 more
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Stacked solder bumping technology for improved solder joint reliability

Microelectronics Reliability, 2001
Abstract Solder joint failure is a serious reliability concern in flip-chip and ball grid array packages of integrated-circuit chips. In current industrial practice, the solder joints take on the shape of a spherical segment. Mathematical calculations and finite element modeling have shown that hourglass-shaped solder joints would have the lowest ...
Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard   +3 more
openaire   +1 more source

Impact of Soldering Atmosphere on Solder Joint Formation

Pan Pacific Symposium, 2008
ABSTRACT The 2007 INEMI roadmap identified the increase of usage of nitrogen in the reflow and wave soldering processes due to the lower wetting forces of the lead free solders. While flux chemistries evolve and improve to promote wetting of lead free alloys, it will take many iterations to get the desired results.
Ursula Marquez de Tino, Denis Barbini, Wesley Enroth   +2 more
openaire   +1 more source

Automatic visual inspection of solder joints

Proceedings. 1985 IEEE International Conference on Robotics and Automation, 2005
This paper describes an approach for automatic inspection of solder joints on printed circuit boards using gray-scale images. Common defects in solder joints are recognized using features computed from segmented solder joint subimages. Unacceptable joints are assigned to one of several defective classes.
Paul J. Besl, Edward J. Delp, Ramesh C. Jain   +2 more
openaire   +1 more source

The Creep-Fatigue Interaction in Solders and Solder Joints

Journal of Electronic Packaging, 1990
Two models are proposed for relating the metallurgy of the solder to the growth of fatigue cracks through solder joints. These models illustrate how different aspects of the creep behavior can contribute to the so-called “creep-fatigue interaction”. The first model treats fatigue crack growth through the solder, far from the interface between solder ...
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Impact of soldering terminal solderability of component and PCB on solder joint interface

2012 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012
The soldering terminal solderability of component and printed circuit board (PCB) has a strong impact on the formation of solder joint interface. The good solderability of the soldering terminal will result in good interface and high reliability of solder joint.
Yuming Wang, Beibei Wang, Jian Cai, Tianxi Wang   +3 more
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Deformation and damage of a solder–copper joint

Microelectronics Reliability, 2003
Reference LMAF-ARTICLE-2003-003doi:10.1016/S0026-2714(03)00303-2View record in Web of Science Record created on 2005-09-14, modified on 2017-05 ...
P. Tropea, Aïssa Mellal, John Botsis
openaire   +1 more source

Dynamic Mechanical Testing of Solder and Solder Joints

Circuit World, 1986
Successful use of solder joints to attach surface mounted devices to printed wiring board substrates requires knowledge of the stress‐strain properties of solder as functions of temperature, time, and loading conditions. In addition, the relatively high operating temperature of solder in comparison to its absolute melting temperature introduces a ...
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Reliability of solder joints under electrical stressing - strain evolution of solder joints

ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258), 2003
Damage mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored.
null Hua Ye, C. Basaran, D. Hopkins, A. Cartwright   +3 more
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Solders and soldered joints in thermal cycling

Chemical and Petroleum Engineering, 1979
E. I. Ardashnikova, A. A. Eliseev, V. I. Sokolov   +2 more
openaire   +1 more source