Multiscale Modeling of Thermo-Electro-Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. [PDF]
Micromachines (Basel)Li P +7 more
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Low thermal stress and high-strength interface in brazing welding Nd:YAG-based advanced laser components. [PDF]
RSC AdvZhang B +9 more
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Ga-Based Liquid Metals: Advances in Interface Thermal and Electrical Regulations for Power Electronics Integration. [PDF]
Materials (Basel)Liu C +8 more
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Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]
J Mater Sci Mater ElectronHsieh CL +4 more
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Soldering Technology 6. Reliability of Soldered Joints.
Circuit Technology, 1992 openaire +2 more sources
Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging. [PDF]
ACS OmegaNoh T +7 more
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Ceramic-Integrated Eddy Current Sensor for Blade Tip Clearance Measurement: Design and Performance Evaluation. [PDF]
Sensors (Basel)Miao Q, Liu Z, Liu Q.
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Molecular Dynamics Study of the Sintering Behavior and Mechanical Properties of Cu@Ag Core-Shell Nanoparticle Solder Paste. [PDF]
Materials (Basel)Zhang X, Gao J, Zhang L.
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Effect of Sn grain orientation on microstructure and mechanical properties of pure Sn solder joints under thermoelectric coupling. [PDF]
Sci RepZhao W +5 more
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Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish. [PDF]
Materials (Basel)Jeyeselan L, Mhd Noor EE.
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