Solder joint inspection using thermal transient characteristics
, 1987 Every year millions of dollars are spent by the electronics industry to identify and correct problems with defective solder joints. This preliminary study uses the thermal cooling transient characteristics of solder joints that have been warmed by short ...
Schellhase, John Charles, 1962-
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Solder Joint Strength Measuring
, 2018 This thesis studies the definition of solder joint strength and its contributing factors. It also evaluates the options provided by using a MARK10 M5-100 digital force gauge with MESURgauge software for measuring solder joint strength and practically ...
Konečný, Aleš
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Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper
HeliyonHigh density packaging technology reduces the pad size and the number of grains contained in the pad. When the polycrystalline pad turns into a single crystal pad, the grain orientation has an important impact on the formation of the intermetallic ...
Jin Xiao, Wei Cheng, Qu Fu-kang
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Design of automatic vision-based inspection system for solder joint segmentation
, 2009 Purpose: Computer vision has been widely used in the inspection of electronic components. This paper proposes a computer vision system for the automatic detection, localisation, and segmentation of solder joints on Printed Circuit Boards (PCBs) under ...
Yarlagadda, Prasad K. +2 more
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Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint. [PDF]
Materials (Basel), 2023 Hashim AN +6 more
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Mechanical properties of solder joint
, 2014 Předkládaná bakalářská práce je zaměřena na používané zkoušky pro zjištění mechanických vlastností pájeného spoje. Dále v této práci jsou popsány nejčastěji používané testy pájených spojů.
Harant, Jaroslav
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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
, 2021 The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices.
Suhir, Ephraim
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Variable-Structure Proportional-Integral-Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit. [PDF]
Micromachines (Basel), 2023 Li M, Cao P, Zhang C, Yan K, Zhang Y.
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Effect of Stiffening the Printed Circuit Board in the Fatigue Life of the Solder Joint. [PDF]
Materials (Basel), 2022 Doranga S, Schuldt M, Khanal M.
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Solder joint testing and failure analysis
, 2012 Adhesively bonded joints within most electronic devices are constantly subjected to a complex combination of tensile-shear loading. These devices are also likely to undergo thermo-mechanical cycling during device processing and service and therefore, the
Kang, Eng Tat.
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