Results 41 to 50 of about 6,402 (214)
Journal of Materials Research and Technology, 2023 Electronic products are subjected to thermal cycling caused by power cycling in service processes. Owing to the difference in the coefficients of thermal expansion (CTEs) of solder joints and other packaging materials, solder joints suffer from ...
Mingwei Xie +4 more
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Quantitative evaluation of voids in lead free solder joints
, 2015 Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections.
Takyi, Gabriel +2 more
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A Review on Effect of Surface Finish and Cooling Rate on Solder Joint Reliability [PDF]
, 2017 The increasing environmental concern over the toxicity of lead (Pb) combined with strict regulations, the use of lead-based solders providing an inevitable driving force for the development of lead-free solder alloys. Many studies have been conducted for
Hardinnawirda, Kahar +2 more
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The Solder Alloys Combination and Influence on Solder Joint Properties
, 2022 Solder joints, solder alloys, low melting point solder aloys, solder joint mechanical strength, resistance of solder ...
Bedlivý, Michal
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Metals, 2022 In this experiment, a Sn35Bi0.3Ag–xIn (x = 0, 0.5, 1.0, 1.5) alloy solder was prepared by electromagnetic induction heating furnace. The effects of In on the thermodynamic properties, wettability, interface microstructure, and soldering performance of ...
Bingwei Shen +6 more
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Electron Microscopy of Gold Soldered Joints [PDF]
Journal of Dental Research, 1968 Electron photomicrographs were taken to examine and compare the structure of the properly heated soldered joints with that of the overheated joints. No diffusion of the solder was observed in the former group and considerable diffusion took place in the latter group.
Kamal El-Ebrashi, M. +2 more
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, 2015 Purpose – The purpose of this paper is to study the effect of intermetallic compound (IMC) layer thickness on the shear strength of surface-mount component 1206 chip resistor solder joints.
Bernasko, Peter K. +4 more
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Automatic visual solder joint inspection [PDF]
IEEE Journal on Robotics and Automation, 1985 An approach is described for the automatic inspection of solder joints on printed circuit boards. Common defects are identified in solder joints and a joint is classified as being good or belonging to one of the defective classes. The motivation for this classification is not just the detection of defective joints, but the desire to automatically take ...
Paul J. Besl +2 more
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Jixie qiangdu, 2018 Based on ANSYS software established board level optical interconnect module finite element model,by means of the analysis of the model of the thermal-structure random vibration coupling,obtained the data of stress and strain under the coupling condition ...
HUA JianWei +4 more
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, 2007 SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been ...
Chen, Hongtao +4 more
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