Results 191 to 200 of about 2,422,228 (271)
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, 2021
The effects of Ni(P) layer thickness (5 μm and 0.7 μm) on the microstructural behavior and electrical reliability of electroless-nickel electroless-palladium immersion gold (ENEPIG) (substrate-side) surface-finished printed circuit boards (PCBs) with Sn ...
Jungsoo Kim +2 more
semanticscholar +1 more source
The effects of Ni(P) layer thickness (5 μm and 0.7 μm) on the microstructural behavior and electrical reliability of electroless-nickel electroless-palladium immersion gold (ENEPIG) (substrate-side) surface-finished printed circuit boards (PCBs) with Sn ...
Jungsoo Kim +2 more
semanticscholar +1 more source
, 2020
A composite solder was prepared by adding different amount Ni modified multi-walled carbon nanotubes (MWCNTs) into the Sn-3.0Ag-0.5Cu (SAC305) solder.
Haozhong Wang +2 more
semanticscholar +1 more source
A composite solder was prepared by adding different amount Ni modified multi-walled carbon nanotubes (MWCNTs) into the Sn-3.0Ag-0.5Cu (SAC305) solder.
Haozhong Wang +2 more
semanticscholar +1 more source
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2020
In this article, the fatigue evolution of solder joints in a photovoltaic (PV) module at a hot climate under thermomechanical cycling was evaluated.
Nan Jiang +4 more
semanticscholar +1 more source
In this article, the fatigue evolution of solder joints in a photovoltaic (PV) module at a hot climate under thermomechanical cycling was evaluated.
Nan Jiang +4 more
semanticscholar +1 more source
Electromigration in solder joints and solder lines
JOM, 2002Electromigration may affect the reliability of flip-chip solder joints. Eutectic solder is a two-phase alloy, so its electromigration behavior is different from that in aluminum or copper interconnects. In addition, a flipchip solder joint has a built-in currentcrowding configuration to enhance electromigration failure.
H. Gan, W. J. Choi, G. Xu, K. N. Tu
openaire +1 more source
Microelectronics and reliability, 2020
In this work, multi-walled carbon nanotubes (MWCNTs) reinforced Sn-5Sb/Cu composite solder joints were synthesized and the effects of MWCNTs addition on the microstructure evolution and hardness of the Sn-5Sb solder alloy during various thermal aging ...
T. Dele-Afolabi +3 more
semanticscholar +1 more source
In this work, multi-walled carbon nanotubes (MWCNTs) reinforced Sn-5Sb/Cu composite solder joints were synthesized and the effects of MWCNTs addition on the microstructure evolution and hardness of the Sn-5Sb solder alloy during various thermal aging ...
T. Dele-Afolabi +3 more
semanticscholar +1 more source
Solder joints on rustless alloys
The Journal of the American Dental Association, 1959Passivation is a method of restoring the continuity of the oxide film on metal surfaces in order to reduce corrosion. Nickelchromium alloys should be chemically or electrically passivated before these alloys are soldered. Wherever possible, soldered nickel-chromium alloys should be scrubbed mechanically, dried and set aside to be passivated ...
S M, BIEN, H D, AYERS
openaire +2 more sources
, 2020
In 3D IC technology, when the size of the micro-bump solder joint is reduced to 10 µm, the scallop-type Cu6Sn5 grains on opposite sides of the joint can interact directly by contacting each other during the solid–liquid interdiffusion reaction.
A. Gusak, King-Ning Tu, Chih Chen
semanticscholar +1 more source
In 3D IC technology, when the size of the micro-bump solder joint is reduced to 10 µm, the scallop-type Cu6Sn5 grains on opposite sides of the joint can interact directly by contacting each other during the solid–liquid interdiffusion reaction.
A. Gusak, King-Ning Tu, Chih Chen
semanticscholar +1 more source
Microstructure evolution and grain orientation of IMC in Cu-Sn TLP bonding solder joints
Journal of Alloys and Compounds, 2019In this work, Cu/Sn/Cu solder joints were fabricated by low temperature transient liquid phase (TLP) bonding. The microstructure evolution and grain orientation of intermetallic compounds (IMC) in Cu-Sn solder joints were systematically investigated by ...
Lei Sun, Ming-He Chen, Liang Zhang
semanticscholar +1 more source
, 2020
The effect of aging on reliability of Sn-58 wt%Bi solder joint with Ag-decorated multi-walled carbon nanotubes (Ag-MWCNTs) was investigated for the LED package components.
Bum-Geun Park +3 more
semanticscholar +1 more source
The effect of aging on reliability of Sn-58 wt%Bi solder joint with Ag-decorated multi-walled carbon nanotubes (Ag-MWCNTs) was investigated for the LED package components.
Bum-Geun Park +3 more
semanticscholar +1 more source
Automatic solder joint inspection
IEEE Transactions on Pattern Analysis and Machine Intelligence, 1988The task of automating the visual inspection of pin-in-hole solder joints is addressed. Two approaches are explored: statistical pattern recognition and expert systems. An objective dimensionality-reduction method is used to enhance the performance of traditional statistical pattern recognition approaches by decorrelating feature data, generating ...
Sandra L. Bartlett +5 more
openaire +1 more source