Multiscale Modeling of Thermo-Electro-Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. [PDF]
Micromachines (Basel)Li P +7 more
europepmc +1 more source
Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints during Electromigration. [PDF]
Materials (Basel), 2021 Yue W, Ding C, Qin H, Gong C, Zhang J.
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A Review: Solder Joint Cracks at Sn-Bi58 Solder ACFs Joints
, 2019 Shuye Zhang +3 more
openaire +2 more sources
Effect of Sn grain orientation on microstructure and mechanical properties of pure Sn solder joints under thermoelectric coupling. [PDF]
Sci RepZhao W +5 more
europepmc +1 more source
The role of microstructure in the thermal fatigue of solder joints. [PDF]
Nat CommunXian JW +5 more
europepmc +1 more source
Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding. [PDF]
Materials (Basel), 2021 Jeong G +7 more
europepmc +1 more source
Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling. [PDF]
J Electron MaterHsieh CL, Coyle RJ, Gourlay CM.
europepmc +1 more source
Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints. [PDF]
Sci RepChen W, Zhang K, Fan Y, Zhang C, Wang N.
europepmc +1 more source
Thermal Fatigue Failure of Micro-Solder Joints in Electronic Packaging Devices: A Review. [PDF]
Materials (Basel)Li L, Du X, Chen J, Wu Y.
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