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Effect of Graphene Nanosheet Addition on the Wettability and Mechanical Properties of Sn-20Bi-xGNS/Cu Solder Joints. [PDF]
Materials (Basel), 2020 Yang W +5 more
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Defect inspection of flip chip solder joints based on non-destructive methods: A review
Microelectronics Reliability, 2020Flip chip technology has been widely used in integrated circuit packages due to its superiority of performance in various aspects. The solder joints sandwiched between chips and organic substrates, act as the mechanical and electrical connections in flip
Michael Pecht, Lei Su
exaly +2 more sources
Machine learning framework for predicting reliability of solder joints
Soldering and Surface Mount Technology, 2019Purpose This paper aims to present a machine learning framework for using big data analytics to predict the reliability of solder joints. The purpose of this study is to accurately predict the reliability of solder joints by using big data analytics ...
Sung Yi
exaly +2 more sources
Effect of aging on mechanical properties of high temperature Pb-rich solder joints
Microelectronics Reliability, 2018The effect of aging on the evolution of interfacial microstructure and mechanical properties of Pb-rich PbSnAg solder joints with different Sn content was investigated. Tensile samples were prepared by soldering two pieces of Ni or Cu strips resulting in
G Khatibi
exaly +2 more sources
Journal of Manufacturing Processes, 2021
Cu-foam sheets with the thicknesses of 0.15 mm and 0.5 mm were utilized as strengthening structure to improve the performances of the Sn3.0Ag0.5Cu (SAC305)/Cu solder joints.
X. Yi, Ruhua Zhang, Xiao-Wu Hu
semanticscholar +1 more source
Cu-foam sheets with the thicknesses of 0.15 mm and 0.5 mm were utilized as strengthening structure to improve the performances of the Sn3.0Ag0.5Cu (SAC305)/Cu solder joints.
X. Yi, Ruhua Zhang, Xiao-Wu Hu
semanticscholar +1 more source
Journal of Manufacturing Processes, 2021
The effects of different ultrasonic treatment time on microstructure evolution and mechanical property of Cu/Sn-3.0Ag-0.5Cu (SAC305) solder joints were investigated.
Xiao-Wu Hu +3 more
semanticscholar +1 more source
The effects of different ultrasonic treatment time on microstructure evolution and mechanical property of Cu/Sn-3.0Ag-0.5Cu (SAC305) solder joints were investigated.
Xiao-Wu Hu +3 more
semanticscholar +1 more source
Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2021In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder joints was established based on the life data.
Yao-Jun Chen +5 more
semanticscholar +1 more source