Results 161 to 170 of about 2,422,228 (271)

Effects of bismuth on the microstructure and crack propagation in Sn-Ag-Cu-Bi solder joints during thermal cycling. [PDF]

J Mater Sci Mater Electron
Hsieh CL, Coyle RJ, Belyakov SA, Xian JW, Gourlay CM.   +4 more
europepmc   +1 more source

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing. [PDF]

Materials (Basel), 2021
Ramli MII, Salleh MAAM, Sandu AV, Amli SFM, Said RM, Saud N, Abdullah MMAB, Vizureanu P, Rylski A, Chaiprapa J, Nabialek M.   +10 more
europepmc   +1 more source

Multiscale Modeling of Thermo-Electro-Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis. [PDF]

Micromachines (Basel)
Li P, Huang J, Zhang J, Gong H, Wang J, Zuo D, Su M, Shi J.   +7 more
europepmc   +1 more source

Crystallographic Characteristic Effect of Cu Substrate on Serrated Cathode Dissolution in Cu/Sn-3.0Ag-0.5Cu/Cu Solder Joints during Electromigration. [PDF]

Materials (Basel), 2021
Yue W, Ding C, Qin H, Gong C, Zhang J.
europepmc   +1 more source

Research of the reliability of lead-free solder joints

, 2011
This work deals research of the reliability of leed-free solder joints. It summarizes the basic knowledge of lead-free solder alloys, soldering and testing process, the soldered joints.
Pelc, Miroslav
core  

Effect of Sn grain orientation on microstructure and mechanical properties of pure Sn solder joints under thermoelectric coupling. [PDF]

Sci Rep
Zhao W, Zhang K, Zhang Y, Liu Z, Zhang H, Zhang C.   +5 more
europepmc   +1 more source

Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding. [PDF]

Materials (Basel), 2021
Jeong G, Yu DY, Baek S, Bang J, Lee TI, Jung SB, Kim J, Ko YH.   +7 more
europepmc   +1 more source

Effect of electromigration on microstructure and properties of CeO₂ nanopartical-reinforced Sn58Bi/Cu solder joints. [PDF]

Sci Rep
Chen W, Zhang K, Fan Y, Zhang C, Wang N.
europepmc   +1 more source

Soldering Technology. Reliability of Soldered Joints.

Circuit Technology, 1992
openaire   +2 more sources

Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging

Journal of Materials Science, 2018
Ming-Yue Xiong, Liang Zhang
semanticscholar   +1 more source