The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration. [PDF]
Materials (Basel), 2021 Xu K +8 more
europepmc +1 more source
Highly Dynamic Soft Electrohydraulic Origami Actuators for Agile and Multimodal Robotic Locomotion
SmartBot, Volume 2, Issue 2, June 2026.Most current soft robots still lag far behind their natural counterparts in both agility and speed, mainly attributed to the limited morphing modes and performance of soft actuators. Here, the authors report a new methodology of electrohydraulic origami (EHO) for creating powerful and multimodal soft actuators with large strain, high speed, lightweight,
Wenbo Li +6 more
wiley +1 more source
Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test. [PDF]
Materials (Basel), 2022 Liang K, Wang Y, He Z.
europepmc +1 more source
Water Resources Research, Volume 62, Issue 6, June 2026.Abstract Interbasin groundwater flow (IGF) is increasingly recognized as an important but difficult‐to‐diagnose component of regional groundwater flow systems. Recent studies highlight that major rifts within the Yarlung Zangbo River Basin (YZRB) may facilitate IGF, but the role of all six major rifts remains unclear.
Jianxin Chen +6 more
wiley +1 more source
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints. [PDF]
Materials (Basel), 2021 Dušek K +6 more
europepmc +1 more source
Open Innovation With Maker Communities: Exploring Collaboration Motives and Preferences of Makers
R&D Management, Volume 56, Issue 3, Page 496-518, June 2026.ABSTRACT Companies constantly seek new ways to innovate and integrate external knowledge into their innovation processes. In the era of makerspaces, a new source for collaborative innovation has evolved. As research shows, the users of makerspaces, so‐called makers, tend to be highly creative and innovative.
David Zakoth +2 more
wiley +1 more source
Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures. [PDF]
Materials (Basel), 2022 Chen C, Sun M, Cheng Z, Liang Y.
europepmc +1 more source
Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints. [PDF]
Materials (Basel), 2021 Jiang Q, Deshpande AN, Dasgupta A.
europepmc +1 more source
Void defect detection in BGA solder joints using mathematical morphology
Journal of Measurement Science and Instrumentation, 2017 Voids are one of the major defects in ball grid array（BGA）solder joints due to a large amount of outgassing flux that gets entrapped during reflow.X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-
ZHANG Jun-sheng +4 more
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