Results 151 to 160 of about 7,263 (261)

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

Advanced Materials Technologies, Volume 11, Issue 11, 5 June 2026.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco, Nicola Larovere, Antonio Zagaria, Antonio Pavone, Rosanna Rifino, Gianni Stano   +5 more
wiley   +1 more source

Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review. [PDF]

Materials (Basel), 2022
Ramli MII, Salleh MAAM, Abdullah MMAB, Zaimi NSM, Sandu AV, Vizureanu P, Rylski A, Amli SFM.   +7 more
europepmc   +1 more source

Practical Lithium–Sulfur Batteries: An Integrated Design Roadmap from High‐Loading Cathodes to High‐Energy Pouch Cells

Advanced Science, Volume 13, Issue 33, 15 June 2026.
This review presents an integrated design roadmap for practical lithium–sulfur batteries, moving beyond isolated material breakthroughs to the synergistic combination of three interdependent frontiers: Scale‐Up, Electrolyte‐Cathode Synergy, and AI/ML Data‐Driven Design.
Shihzad Shakil, Fan Wang, Lejun Fu, Yuye Huang, Hanhui Lei, Jiarui Huang, Terence Xiaoteng Liu   +6 more
wiley   +1 more source

Gallium‐Based Liquid Metal Composites for Flexible Sensors: Design Strategies, Sensing Functions, and Application

Advanced Electronic Materials, Volume 12, Issue 11, 8 June 2026.
ABSTRACT In recent years, flexible sensors have played an important role in fields of medical diagnostics and soft robotics for their unique conformability. To further improve the sensing performance, new strategies involving liquid metal‐based composite materials have shown many advantages. Among the emerging new materials, gallium‐based liquid metals
Caicaike Bayin, Zhaojun Xu, Chuyi Zheng, Rui Gao, Liang Guo, Di Zhang, Xiaoli Ma, Xue Han, Weijiang Xue, Cuiping Guo, Yao Li   +10 more
wiley   +1 more source

Finite element simulation of reliability of BGA solder joints under mechanical loading and temperature cycling conditions

Hanjie xuebao
To address the issues of low reliability of ball grid array (BGA) solder joints under combined effect of mechanical loading from heat sinks and thermal cycling loads, with unclear influencing factors from heat sink mechanical loading, a finite element ...
Wenlong LENG, Xubing CHEN, Cong ZHANG, Jie FANG, Dong YE   +4 more
doaj   +1 more source

Author Correction: Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model. [PDF]

Sci Rep, 2023
Bani Hani D, Al Athamneh R, Abueed M, Hamasha S.   +3 more
europepmc   +1 more source

The Path to Future‐Proof Photovoltaics in Europe: Current Status and Impact of Technological Innovation on Reliable and Bankable Photovoltaics

Advanced Energy and Sustainability Research, Volume 7, Issue 6, June 2026.
This article provides an overview of the current state of the art and future improvements in PV technology and explains how changes in the technology and design of individual PV components—at the module level, the balance‐of‐system (BOS) level, or the PV plant level—can affect the reliability, durability, and energy output of a PV system.
Ulrike Jahn, Paula Sánchez‐Friera, David Moser, Marcello Pereira Passaro, Delfina Munoz, Sandra Gallmetzer, Stefano Nicola Granata, Sascha Lindig, Ioannis Tsanakas, Ismail Kaaya, Ivan Gordon   +10 more
wiley   +1 more source

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging. [PDF]

J Mater Sci Mater Electron, 2022
Xin M, Wang X, Sun F.
europepmc   +1 more source

Coaxial Dipole Array With Switching Transmit Sensitivities for Ultrahigh Field MRI

Magnetic Resonance in Medicine, Volume 95, Issue 6, Page 3608-3615, June 2026.
ABSTRACT Purpose To investigate dipole antennas with electronically switchable transmit field patterns to improve flip angle homogeneity in ultra‐high field MRI. Methods Reconfigurable dipole elements that could produce two distinct electronically switchable B1+ field profiles were conceptualized and constructed.
Dario Bosch, Georgiy A. Solomakha, Felix Glang, Martin Freudensprung, Nikolai Avdievich, Klaus Scheffler   +5 more
wiley   +1 more source

Study of solder joints for ball grid array (BGA) assembly

, 2002
This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow ...
Yam, Shong Wai
core   +1 more source