Microstructure Evolution and Shear Strength of the Cu/Au80Sn20/Cu Solder Joints with Multiple Reflow Temperatures. [PDF]
Materials (Basel), 2022 Chen C, Sun M, Cheng Z, Liang Y.
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Effect of Reflow Temperature on Interfacial IMC Growth in Pb-Free/Pb Mixed-Assembly Micro-Solder Joints. [PDF]
Micromachines (Basel)Xiao Y +7 more
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Grain-Scale Anisotropic Analysis of Steady-State Creep in Oligocrystalline SAC Solder Joints. [PDF]
Materials (Basel), 2021 Jiang Q, Deshpande AN, Dasgupta A.
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Interfacial Microstructure Evolution and High-Speed Ball Shear Fracture of SAC305/Cu-20wt%Zn Solder Joints Under Isothermal Aging. [PDF]
Materials (Basel)Park JY, Yoo S.
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Effect of Grain Structure and Ni/Au-UBM Layer on Electromigration-Induced Failure Mechanism in Sn-3.0Ag-0.5Cu Solder Joints. [PDF]
Micromachines (Basel), 2022 Zhang Y, Zhang J, Wang Y, Fang Y.
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Diffusion Barrier Properties of the Intermetallic Compound Layers Formed in the Pt Nanoparticles Alloyed Sn-58Bi Solder Joints Reacted with ENIG and ENEPIG Surface Finishes. [PDF]
Materials (Basel), 2022 Choi H, Kim CL, Sohn Y.
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Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints. [PDF]
J Mater SciHsieh CL, Coyle RJ, Xian JW, Gourlay CM.
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Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow. [PDF]
Materials (Basel), 2022 Zaimi NSM +9 more
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Fabrication and Bonding Strength of Sn-Decorated MWCNT-Reinforced Sn-3.0Ag-0.5Cu Composite Solder Joints: Reflow vs. IPL Soldering. [PDF]
Materials (Basel)Kang D +6 more
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Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. [PDF]
Materials (Basel)Liu J, Saad AA, Zheng Y, Ji H, Bachok Z.
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