Results 141 to 150 of about 7,263 (261)

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions. [PDF]

Materials (Basel), 2023
Jian M, Hamasha S, Alahmer A, Hamasha M, Wei X, Belhadi MEA, Hamasha K.   +6 more
europepmc   +1 more source

Fully Wireless and Flexible Valves for Multiplexed and Prolonged Intravesical Liquid Release

Advanced Healthcare Materials, Volume 15, Issue 23, 19 June 2026.
A fundamental mechanism for the simultaneous control of multiple magnetic valves is reported in a miniature soft robotic patch for intravesical drug delivery, enabling fully wireless and programmable liquid release. Integrated with a bioadhesive interface and induction‐coupling‐based liquid volume sensing, the soft robotic patch is promising to enable ...
Boyang Xiao, Yi Zhu, Yusheng Wang, Janene M. Pierce, Jeffrey J. Tosoian, Xiaoguang Dong   +5 more
wiley   +1 more source

Fatigue and thermal fatigue of Pb-Sn solder joints [PDF]

, 1987
This paper presents a fundamental investigation of the fatigue and thermal fatigue characteristics, with an emphasis on the microstructural development during fatigue, of Sn-Pb solder joints. Fatigue tests were performed in simple shear on both 60Sn-40Pb
Tribula, D., Morris, J.W. Jr., Grivas, D., Frear, D., McCormack, M.   +4 more
core  

Modelling the behavior of solder joints for wafer level SiP

, 2006
Design for manufacture of system-in-package (SiP) structures is dependent on a number of physical processes that affect the final quality of the package in terms of its performance and reliability.
Georgel, V., Richardson, A., D. Liu, J.M. Yannou, N. Dumas, C. Bailey, V. Georgel, Strusevitch, Nadia, N. Strusevich, Dumas, N., Stoyanov, Stoyan, Bailey, Christopher, Yannou, J.M., A. Richardson, Liu, D., S. Stoyanov   +15 more
core   +1 more source

Effect of Sn Grain Orientation on Reliability Issues of Sn-Rich Solder Joints. [PDF]

Materials (Basel), 2022
Shen YA, Wu JA.
europepmc   +1 more source

Metamaterial Antennas Enhance MRI of the Eye and Occipital Brain

Advanced Materials, Volume 38, Issue 32, 8 June 2026.
A radiofrequency antenna platform comprising planar and bend configurations is developed, incorporating structurally integrated epsilon‐negative metamaterial unit cells to enhance MRI. These antennas enable high‐resolution in vivo human MRI of the eye, orbit, and occipital brain. Comprehensive validation, including simulations, phantom experiments, SAR,
Nandita Saha, Bilguun Nurzed, Mostafa Berangi, Andre Kuehne, Helmar Waiczies, Igor Fabian Tellez Ceja, Xiang Hu, Thomas Gladytz, Lisa Krenz, Dave Huebler, Beate Endemann, Claudia Brockmann, Ebba Beller, Oliver Stachs, Thoralf Niendorf   +14 more
wiley   +1 more source

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Crystals
Sn58Bi solder is considered a promising lead-free solder that meets the performance requirements, with the advantages of good wettability and low cost. However, the low melting point characteristic of Sn58Bi poses a serious threat to the high-temperature
Xiangxia Kong, Junjun Zhai, Ruipeng Ma, Fenglian Sun, Xuemei Li   +4 more
doaj   +1 more source

Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. [PDF]

Materials (Basel), 2022
Hsu PN, Lee DL, Tran DP, Shie KC, Tsou NT, Chen C.   +5 more
europepmc   +1 more source

Smart Closed‐Loop Systems in Personalized Healthcare: Advances and Outlook

Advanced Materials Technologies, Volume 11, Issue 12, 18 June 2026.
A smart closed‐loop e‐textile integrates multimodal sensing, onboard processing, wireless communication, and wearable power to enable real‐time physiological/biochemical monitoring and feedback‐controlled therapy. ABSTRACT Smart textiles represent a revolutionary frontier in healthcare, seamlessly blending fabric and advanced technologies to create ...
Safoora Khosravi, Sang Won Lee, Mohammad Abrar Uddin, Sina Hassanpoor, Neha Suvindran, Katherine Le, Harun Arkaz, Harishkumar Narayana, Saeid Soltanian, Danial Khorsandi, Negar Hosseinzadeh Kouchehbaghi, Taeil Kim, Yangzhi Zhu   +12 more
wiley   +1 more source

Effects of Voids on Thermal Fatigue Reliability of Solder Joints on Inner Rings in Ball Grid Array Packaging by Finite Element Analysis. [PDF]

Micromachines (Basel), 2023
Hu X, Liu L, Liu S, Ruan M, Chen Z.
europepmc   +1 more source