Machanical testing of solder joints
, 2012 The project contains theoretical research of electrotechnical manufacture for lead-free reflow soldering. It contains characterization of soldering processes.
Drab, Tomáš
core
Study of lead-free solder joints reliability
, 2010 The thesis deals with problems concerning lead free soldering especially the study of the structure of solder joints and their reliability. The thesis evaluates lead free solder alloys.
Pícha, Jan
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Author Correction: Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model. [PDF]
Sci Rep, 2023 Bani Hani D +3 more
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Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging. [PDF]
J Mater Sci Mater Electron, 2022 Xin M, Wang X, Sun F.
europepmc +1 more source
The Effect of Grain Orientation of β-Sn on Copper Pillar Solder Joints during Electromigration. [PDF]
Materials (Basel), 2021 Xu K +8 more
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Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test. [PDF]
Materials (Basel), 2022 Liang K, Wang Y, He Z.
europepmc +1 more source
, 2013 Předkládaná bakalářská práce je zaměřena na popis problematiky spolehlivosti pájených spojů, požadavky na jejich jakost a zejména na metody užívané k jejich kontrole.
Lomberský, Filip
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Void defect detection in BGA solder joints using mathematical morphology
Journal of Measurement Science and Instrumentation, 2017 Voids are one of the major defects in ball grid array（BGA）solder joints due to a large amount of outgassing flux that gets entrapped during reflow.X-ray nondestructive machines are used to make voids visible as lighter areas inside the solder joints in X-
ZHANG Jun-sheng +4 more
doaj
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints. [PDF]
Materials (Basel), 2021 Dušek K +6 more
europepmc +1 more source
Effect of Surface Finish on Electromigration Reliability of Line-Type Sn-3.0Ag-0.5Cu Solder Joints. [PDF]
Materials (Basel)Meng S, Huang M.
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