Results 121 to 130 of about 2,422,228 (271)

Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints. [PDF]

Appl Nanosci, 2023
Wodak I, Yakymovych A, Svec P, Orovcik L, Khatibi G.   +4 more
europepmc   +1 more source

An Interconnection Strategy for Thermally Sensitive Solar Cells Employing Electrically Conductive Tape

Solar RRL, Volume 10, Issue 17, 15 September 2026.
Commercially available electrically conductive tapes are evaluated as low‐temperature interconnection materials for next‐generation photovoltaic devices. The tapes provide stable electrical contacts, strong adhesion, and module reliability comparable to advanced solder‐free technologies while eliminating thermal curing.
Yanxin Liu, Andreas Lambertz, Ian Marius Peters, Unisa Adikalie Kargbo, Bart Pieters, Benedikt Fischer, Henrike Gattermann, Xuanlei Du, Volker Lauterbach, Karsten Bittkau, Uwe Rau, Kaining Ding   +11 more
wiley   +1 more source

Intermetallic compound layer and fatigue crack evolution of Bi-contained Sn-1.0Ag-0.5Cu solder under thermal aging and thermal fatigue

Journal of Materials Research and Technology
The Sn-1.0Ag-0.5Cu-xBi solder joints with different Bi content were prepared by reflow soldering. The shear strength, intermetallic compound layer, and fatigue evolution in solder joints were then investigated under thermal aging and thermal fatigue ...
Junjie Zhao, Jun Wu, Jiayu Zhang, Mingqin Liao, Fengjiang Wang   +4 more
doaj   +1 more source

Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints. [PDF]

Polymers (Basel), 2023
Zhang P, Xue S, Liu L, Wang J, Tatsumi H, Nishikawa H.   +5 more
europepmc   +1 more source

3D X-Ray Based BGA Solder Joints Inspection Algorithm

, 2010
In order to improve the precision of BGA solder joints inspection, the cross-section images of BGA solder joints are analyzed based on the 3D X-ray technology. The BGA solder joints or the BGA ball and background is segmented.
Rui Qiu Zhang, Zhong Chen, Xian Min Zhang   +2 more
core   +1 more source

Neural-fuzzy machine learning approach for the fatigue-creep reliability modeling of SAC305 solder joints. [PDF]

Sci Rep, 2023
Bani Hani D, Al Athamneh R, Abueed M, Hamasha S.   +3 more
europepmc   +1 more source

Voids in Solder Joints

, 2016
Předkládaná bakalářská práce je zaměřena na řešení vzniku dutin v bezolovnatých pájených spojích. Teoretická část se zabývá problematikou bezolovnatého pájení, složením a vlastnostmi nejpoužívanějších bezolovnatých pájecích slitin.
Kouba, Ondřej
core  

On axisymmetric adhesive joints with graded interface stiffness

, 2013
An improved analytical model is presented for the stress analysis of interface stiffness graded axisymmetric adhesive joints. The governing integro-differential equation of the problem is obtained through a variational method which minimizes the ...
Kumar, S., Scanlan, J.P.
core   +1 more source

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Crystals
Sn58Bi solder is considered a promising lead-free solder that meets the performance requirements, with the advantages of good wettability and low cost. However, the low melting point characteristic of Sn58Bi poses a serious threat to the high-temperature
Xiangxia Kong, Junjun Zhai, Ruipeng Ma, Fenglian Sun, Xuemei Li   +4 more
doaj   +1 more source

Aging Interfacial Structure and Abnormal Tensile Strength of SnAg3Cu0.5/Cu Solder Joints. [PDF]

Materials (Basel), 2022
Chen D, Qin J, Zhang X, Liang D, Bai H, Yi J, Yan J.   +6 more
europepmc   +1 more source