Results 111 to 120 of about 2,422,228 (271)
机车电传动, 2020 In order to solve the shortcomings of traditional accelerated life test, such as long test time and large sample size, it is necessary to design comparative accelerated life test.
Fan YANG
doaj
Journal of Surface Mount Technology, 2006 ABSTRACT Recently, voids in solder joints has been a hot topic of discussion within the electronics manufacturing industry. The main interest stems from the impact that these voids have on the long term reliability of solder joints. But, not all solder joints voids are the same.
openaire +1 more source
Architecture‐Driven Sensor Stability in Weft‐Knitted Engineering Textiles
Advanced Engineering Materials, Volume 28, Issue 19, 7 October 2026.Textile‐integrated sensor architectures are systematically compared to evaluate their electromechanical behavior under combined mechanical and environmental loading. Pocket‐based integration exhibits stable and reproducible signals, whereas tunnel‐based routing shows higher sensitivity accompanied by increased variability.
Adnan Maroof Khan +5 more
wiley +1 more source
A Geometrically Transient Platform for Bioelectronic Implants
Advanced Materials, Volume 38, Issue 55, 1 October 2026.Minimally invasive bioelectronic implants often compromise performance for smaller sizes. To resolve this optimization dilemma, a wireless bioelectronic implant with a transient geometry is introduced (MiFi). The origami‐inspired device miniaturizes up to sixfold for syringe insertion and autonomously unfolds post‐implantation.
Selin Olenik +13 more
wiley +1 more source
Investigations On The Properties Of Sn-8zn-3Bi Lead-Free And Sn-37Pb Eutectic Solder Alloys [TS610. D928 2005 f rb] [Microfiche 8175]. [PDF]
, 2005 Sifat-sifat logam pateri bebas plumbum Sn-8Zn-3Bi dan logam pateri eutektik Sn-37Pb yang bersentuhan dengan substrak kuprum telah dikaji. Properties of Sn-8Zn-3Bi lead-free solder and Sn-37Pb eutectic solder in contact with copper substrates have been
Duong, Ngoc Binh
core +1 more source
Applied Research, Volume 5, Issue 5, October 2026.Damp heat aging degraded both solder interconnections and silicon solar cells, leading to increased electrical resistance and reduced photoluminescence intensity. Among the solder alloys evaluated, SnAgCu exhibited the most stable electrical performance, making it a promising candidate for improving the long‐term reliability of solar‐powered UAVs ...
Norliza Ismail +6 more
wiley +1 more source
Application of Superplasticity in Solder Joints
, 1990 The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strain ...
J. Seyyedi +4 more
core +1 more source
Design of an 8‐Channel Transmit 32‐Channel Receive 11.7T Head Coil and Evaluation of SNR Gains
Magnetic Resonance in Medicine, Volume 96, Issue 4, Page 2004-2018, October 2026.ABSTRACT Purpose To design and develop an 8‐channel transmit 32‐channel receive 11.7T head coil for the strongest human MRI scanner to date, demonstrate safety, and evaluate signal‐to‐noise ratio (SNR) gains compared to 7T, the most used ultra‐high‐field (UHF) platform.
Son Chu +8 more
wiley +1 more source
MetalsThis study investigated the microstructure and properties of soldered joints of AISI 304 stainless steel and PMMA thermoplastic or AW-1050A aluminum alloys made using Resistance Element Soldering (RES) technology.
Pavol Sejč +6 more
doaj +1 more source