Results 111 to 120 of about 7,263 (261)

Not “Cut Out” For the Field: An Analysis of Women Navigating Gendered Boundaries in STEM Education

open access: yesGender, Work &Organization, EarlyView.
ABSTRACT Gender inequities in access and promotions in STEM (science, technology, engineering, and mathematics) education and careers pose challenges for women to persist and excel in the field. However, limited scholarship examines how women's STEM pathways are shaped by informal and formal STEM education in the K–12 period.
Zora Haque   +3 more
wiley   +1 more source

Creep properties of Sn‐0.7Cu composite solder joints reinforced with nano‐sized Ag particles

open access: yes, 2010
PurposeThe purpose of this paper is to investigate the creep properties of Sn‐0.7Cu composite solder joints reinforced with optimal nano‐sized Ag particles in order to improve the creep performance of lead‐free solder joints by a composite approach ...
Jianping Liu   +6 more
core   +1 more source

Interfacial reaction and mechanical properties of Sn–Bi Cu core solder joints

open access: yesJournal of Materials Research and Technology
Sn–Bi solder, considered to be a lead-free solder that can be used in the packaging of heat-sensitive devices, has been attracting increasing attention from researchers due to its excellent mechanical properties. The microstructure evolution, interfacial
Shijie Ouyang   +5 more
doaj   +1 more source

Investigation of Misleading Techniques Used in Online Fluoride Misinformation

open access: yesInternational Journal of Dental Hygiene, EarlyView.
ABSTRACT Objectives Fluoride misinformation can fuel anti‐fluoridation movements, influencing political decisions and dental treatment choices. This study aimed to elucidate the misleading techniques used to produce online fluoride misinformation. Methodology Two independent investigators searched scientific databases for references that supported or ...
Matheus Lotto   +4 more
wiley   +1 more source

The mechanical properties degradation of solder joints under thermal cycling

open access: yes, 2000
The method of mount strain gages is used to measure the stress/strain hysteresis loops of the solder joints under thermal cycling. The results show that different solders have different loops; the shapes of the loops will change and the shear modules ...
Lee, Shi Wei Ricky   +5 more
core   +1 more source

Fatigue Life Estimation of Surface Mount Solder Joints [PDF]

open access: yes, 2020
-A novel and direct method to measure the stress-strain properties of surface mount solder joints is proposed in this paper. The specimen used in the experiments is a quad flat pack (QFP)-solder-printed circuit board (PCB) assembly and the fabrication of
I K Hui   +3 more
core  

Study of lead-free solder joints reliability

open access: yes, 2010
The thesis deals with problems concerning lead free soldering especially the study of the structure of solder joints and their reliability. The thesis evaluates lead free solder alloys.
Pícha, Jan
core   +1 more source

Exploring Complex Historical Figures through a Modified Critical Making Framework

open access: yesInternational Journal of Art &Design Education, EarlyView.
Abstract This paper examines ‘critical making’ as a framework for exploring complex problems and topics. Critical making combines an iterative process of making with research, reflection and analysis. The authors present a modified critical making process that builds on the reflexive material engagement introduced by the originator of critical making ...
Jill Kraeger   +2 more
wiley   +1 more source

Reliability of SnAgCu Solder Joints Under Thermo-Mechanical Stresses [PDF]

open access: yes, 2005
Tin-lead has been used as a primary solder material in the electronics industry for decades. However, lead is a toxic material. Recently, many recommendations have been made and much legislation has been proposed in order to ban the use of lead in ...
Nurmi, Sami
core  

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