Results 91 to 100 of about 2,422,228 (271)
FINITE ELEMENT ANALYSIS ON THE EFFECT OF SOLDER JOINT GEOMETRY FOR THE RELIABILITY OF BALL GRID ARRAY ASSEMBLY WITH FLEXIBLE AND RIGID PCBS [PDF]
In the present study, three-dimensional (3D) finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible and rigid PCBs ...
CHUN-SEAN LAU +3 more
doaj
Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five
Feng-Jiang Wang +3 more
semanticscholar +1 more source
This work reports a laser diode‐based self‐mixing interferometry imager featuring illumination‐invariance imaging, a 500 kHz pixel rate, and an 8.77 µm lateral resolution. It also features a programmable field‐of‐view and leading space‐bandwidth product that surpasses existing technologies by an order of magnitude, enabling cross‐scale workflow ...
Zhou Su +5 more
wiley +1 more source
This work deals with the degradation of solar modules with varying material combinations under accelerated aging conditions. By in situ moisture measurements and simulations of oxygen ingress, the consumption of stabilizing additives and polymer degradation can be correlated spatially resolved with the penetrating stressors.
Robert Heidrich +11 more
wiley +1 more source
Research on Lifespan Prediction Methods Using Ultrasonic Microimaging for Electronic Packaging
Addressing the issue of lifespan prediction for electronic packages under thermal loading, this paper proposes a method for predicting the lifespan of electronic packages based on ultrasonic microimaging.
Haotian Wang +4 more
doaj +1 more source
Tailoring Model‐Based Systems Engineering for Sub‐100 g PlanarSats: A Power‐First View Stack
ABSTRACT This paper addresses how to apply model‐based systems engineering (MBSE) to ultrasmall planar satellites under severe power and resource constraints. PlanarSats are sub‐100‐gram spacecraft built as single printed‐circuit boards where the same surface must host both electronics and solar cells, so power generation, geometry, and component ...
Mehmet Şevket Uludaǧ +1 more
wiley +1 more source
Accelerated degradation of solder joint interconnections in crystalline silicon photovoltaic (c-Si PV) modules drives the high failure rate of the system operating in elevated temperatures.
O. Ogbomo +3 more
semanticscholar +1 more source
This study provides a clear demonstration of active ultraviolet (UV) regulation in free‐ranging lizards and supports that microhabitat choice likely constrains UV regulation more than thermoregulation. Overall, it serves to establish UV as a parallel regulatory axis of physiological homeostasis and expand the range of testable hypotheses in animal ...
Matthew S. Lattanzio
wiley +1 more source
In this study, the effects of crosshead speeds on solder strength of Cu/Sn–9Zn/Cu lap joints were determined. The solder strength of lap joints increased with increasing crosshead speeds.
Muhammad Ghaddafy Affendy +1 more
doaj +1 more source
‘Fine Men from Afar’: Cricket and Empire on the Home Front
Abstract During the Second World War, contrary to enduring images of bombardment and scarcity, people on Britain's ‘Home Front’ continued to take part in a broad array of sporting activities. Cricket played a more significant role in the wartime sporting landscape than many historians have previously recognized.
Michael Collins
wiley +1 more source

