Results 91 to 100 of about 7,263 (261)
In this study, the effects of crosshead speeds on solder strength of Cu/Sn–9Zn/Cu lap joints were determined. The solder strength of lap joints increased with increasing crosshead speeds.
Muhammad Ghaddafy Affendy +1 more
doaj +1 more source
Ultrasound‐Assisted Epoxy Resin Curing Monitored by Impedance Spectroscopy
Ultrasound enhances epoxy cure rates via localized heating without altering cure kinetics. Impedance spectroscopy provides a direct, non‐destructive measure of cure progression, enabling accurate mapping of degree of cure in real time. ABSTRACT Epoxy resins are widely used in aerospace and automotive manufacturing as structural adhesives and matrices ...
Daniel Csehngeri +2 more
wiley +1 more source
Material Behavior of Mixed Formulation Solder Joints
The transition from tin-lead to lead free soldering in the electronics manufacturing industry has been in progress for the past 10 years. In the interim period before lead free assemblies are uniformly accepted, mixed formulation solder joints are ...
Michael J. Bozack +4 more
core +1 more source
This study examines the reuse readiness of photovoltaic modules through the Swiss PV Circle project. Results confirm technical feasibility with cost savings from targeted preselection, whereas economic viability depends on module age, testing, and market conditions.
Roger Nyffenegger +6 more
wiley +1 more source
Analysis of flip-chip solder joints under isothermal vibration loading
S.138-142This work focuses on the reliability needs which are caused by the use of recent package solutions for harsh environmental use cases such as assisted or autonomous driving.
Bock, Karlheinz +4 more
core +1 more source
Finite element comparative study on creep and random vibrations of solder joints in BGA package
As the demand for increasing miniaturisation and functionality of electronic devices soars, understanding the creep and random vibration of solder joints (SJs) in BGA packages in devices is critical to achieving high device reliability.
Joshua A. Depiver +2 more
doaj +1 more source
Adaptive CUSUM Chart for Simultaneous Monitoring of Mean and Variance
ABSTRACT Simultaneously monitoring changes in both the mean and variance is a fundamental problem in statistical process control, and numerous methods have been developed to address it. However, many existing approaches face notable limitations: Some rely on tuning parameters that can significantly affect performance; others are biased toward detecting
Gokul Parakulum, Jun Li
wiley +1 more source
Thermal fatigue-life prediction of lead-free solder joints
Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package ...
Shangguan, Dongkai +2 more
core +1 more source
Actuation Strategies for Underwater Jet‐Propelled Soft Robots
ABSTRACT This review article examines jet‐propulsion mechanisms in underwater soft robotic systems, focusing exclusively on physically fabricated and experimentally validated robots. Covering research published from 2013 to 2025, this study classifies and evaluates jet‐propulsion robots based on their actuation mechanisms.
Angel Kitone +3 more
wiley +1 more source
T‐800: An 800 Hz Data Glove for Precise Hand Gesture Tracking
Hand motion capture provides critical insights into human dexterity and facilitates advancements in robotic manipulation, yet existing systems are limited by a trade‐off between temporal resolution and visual occlusion. Here, the authors present T‐800, a high‐bandwidth data glove achieving synchronized full‐hand motion capturing at 800 Hz.
Haoyang Luo +7 more
wiley +1 more source

