Results 81 to 90 of about 7,263 (261)

Bridging Performance and Fate: A Framework for Sustainable, Composite‐Based Flexible Electronic Systems

open access: yesAdvanced Electronic Materials, EarlyView.
Composite‐based flexible electronics integrate biodegradable polymers, conductive networks, and multilayer device architectures to balance electrical performance, mechanical durability, and controlled degradation. Interfacial engineering and encapsulation regulate transport stability and operational lifetime, while programmed disassembly enables ...
Sayam, Sangho Cho
wiley   +1 more source

FINITE ELEMENT ANALYSIS ON THE EFFECT OF SOLDER JOINT GEOMETRY FOR THE RELIABILITY OF BALL GRID ARRAY ASSEMBLY WITH FLEXIBLE AND RIGID PCBS [PDF]

open access: yesJournal of Engineering Science and Technology, 2014
In the present study, three-dimensional (3D) finite element simulation on 132 PIN fleXBGATM package was performed to predict the effect of solder joint geometry on the reliability of Ball Grid Array (BGA) solder joints on flexible and rigid PCBs ...
CHUN-SEAN LAU   +3 more
doaj  

A Multimodal Intelligent System for Human Digital Twin Simulation with Continuous Kinematic Data Tracking, Biometric Prognosis, and Cognitive State Feedback in Industrial Environments

open access: yesAdvanced Intelligent Discovery, EarlyView.
This article implements a unified human digital twin framework that integrates cutting edge actuation, sensing, simulation, and bidirectional feedback capability. The approach includes integrating multimodal sensing, AI, and biomechanical simulation into one compact system.
Tajbeed Ahmed Chowdhury   +4 more
wiley   +1 more source

Application of Superplasticity in Solder Joints

open access: yes, 1990
The lifetime of non-compliant eutectic solder joints was improved by an order magnitude by rapid quenching. The quenching produces a fine equiaxed superplastic grain structure which lowers the stresses in the solder joints for the fatigue cycle strain ...
J. Seyyedi   +4 more
core   +1 more source

Modular Electronic Microrobots With Onboard Sensor‐Program‐Steered Locomotion

open access: yesAdvanced Intelligent Systems, EarlyView.
Modular electronic smartlet microrobots integrate ambient‐light energy harvesting, photodetection, programmable CMOS control, and bubble‐based actuation within a sub‐millimeter fold‐up architecture. A 58‐bit on‐board CMOS chiplet enables sensor–program steered switching between independently addressable actuators, achieving closed‐loop 2D navigation in
Vineeth K. Bandari   +6 more
wiley   +1 more source

3D‐Printed Shark‐Inspired Soft–Hard Hybrid Underwater Robot With Buoyancy Control and Onboard Vision

open access: yesAdvanced Intelligent Systems, EarlyView.
A fully self‐contained shark‐inspired underwater robot is developed using 3D‐printed soft–hard hybrid structures, servo‐driven propulsion, and pump‐based buoyancy control. The platform achieves three‐dimensional locomotion and onboard vision‐based target tracking, offering a reproducible and accessible framework for biomimetic underwater robot research.
Shotaro Saito   +3 more
wiley   +1 more source

Research on Lifespan Prediction Methods Using Ultrasonic Microimaging for Electronic Packaging

open access: yesApplied Sciences
Addressing the issue of lifespan prediction for electronic packages under thermal loading, this paper proposes a method for predicting the lifespan of electronic packages based on ultrasonic microimaging.
Haotian Wang   +4 more
doaj   +1 more source

Soft Active Electromyography Interface for Machine Learning‐Enabled Silent Speech Recognition

open access: yesAdvanced Intelligent Systems, EarlyView.
A soft, hand‐worn electromyography interface enables intent‐driven silent speech recognition without continuous facial attachment. The device integrates liquid‐metal interconnects, a transparent flexible circuit, and elastomer encapsulation with a fingertip electrode that contacts perioral muscles only on demand.
Yuta Kurotaki   +8 more
wiley   +1 more source

3D X-Ray Based BGA Solder Joints Inspection Algorithm

open access: yes, 2010
In order to improve the precision of BGA solder joints inspection, the cross-section images of BGA solder joints are analyzed based on the 3D X-ray technology. The BGA solder joints or the BGA ball and background is segmented.
Rui Qiu Zhang   +2 more
core   +1 more source

Performance assessment of a potential underground thermal storage facility: Case study of the closed mine Prosper‐Haniel in the Ruhr coal mining area in Germany

open access: yesDeep Underground Science and Engineering, EarlyView.
This study demonstrates the feasibility of an underground closed‐loop thermal storage facility at a post‐mining site, intended for seasonal heat energy storage. Its principal design shows water flow directions in winter and summer (1, 2), heat pumps (3), an upper water reservoir (4), and connecting pipes (5).
Dmytro Rudakov, Oleksandr Inkin
wiley   +1 more source

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