Results 81 to 90 of about 2,422,228 (271)
Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study
In this paper, novel application possibilities of CuO nanoparticles were investigated in SAC0307 solder alloy for composite soldering purposes. CuO nanoparticles in 0.25 and 0.5 wt% were mixed into the solder paste to produce composite solder joints ...
Balázs Illés +4 more
doaj +1 more source
How can additive manufacturing enable components that sense, adapt, heal, and power themselves? This review synthesizes recent advances in smart functionalities, manufacturing technologies, and intelligent design strategies, revealing a pathway toward fully integrated, autonomous, and multifunctional systems across diverse engineering sectors. Additive
Aiswarya Rony +3 more
wiley +1 more source
Ni/Cu-core + Solder/Cu heterogenous Cu-core solder joints (Ni-Cu Cu-core joints) were subjected to aging experiments at 100 ℃ for 0 h, 48 h, 120 h, and 360 h, respectively. The microstructure evolution of interfacial intermetallic compound (IMC), tensile
Zongxiang YAO +6 more
doaj +1 more source
Sn–Bi-based solders have attracted considerable attention as promising materials for use in low-temperature soldering processes due to their low melting point of 139 °C and their excellent wettability.
Kwan-Soo Lim, Jeong-Won Yoon
doaj +1 more source
This study demonstrates the feasibility of an underground closed‐loop thermal storage facility at a post‐mining site, intended for seasonal heat energy storage. Its principal design shows water flow directions in winter and summer (1, 2), heat pumps (3), an upper water reservoir (4), and connecting pipes (5).
Dmytro Rudakov, Oleksandr Inkin
wiley +1 more source
Comprehensive properties of Sn58Bi/Cu and Sn58Bi‐0.6Ni/Cu solder joints were systematically investigated after 200, 400, 600, 800, 1000, and 1200 thermal shock cycles ranging from 218 K to 398 K.
Jiamin Zhang +4 more
doaj +1 more source
The Joule heat generated during the opreation of microelectronic devices can subject the Sn-Bi solder alloy to isothermal aging, which affects the reliability of solder joint interconnections. In this study, the effect of nickel-modified reduced graphene
Wenchao Yang +7 more
doaj +1 more source
Artificial structures for human‐machine interfaces with closed‐loop interaction
Artificial structures bridge sensing and feedback in closed‐loop human‐machine interfaces by providing geometry‐enabled mechanical and functional programmability. This review maps the role of artificial structures in diverse sensing modalities and feedback strategies, and illustrates their integration into closed‐loop interaction systems, highlighting ...
Taiqi Hu +4 more
wiley +1 more source
Automatic surface mount solder joints inspection [PDF]
This thesis reports the research results on automatic inspection of solder joints on printed circuit boards. The previous work on this subject has been advanced significantly in the following three aspects.
Liu, Zhu
core +1 more source
Intensity Noise Dynamics in Terahertz Quantum Cascade Lasers
Intensity‐noise dynamics in terahertz quantum cascade lasers are investigated across single‐mode, dense‐comb and harmonic‐comb regimes using graphene thermoelectric detectors. Harmonic combs show ∼10% lower relative intensity noise, while RIN scales as P0−γ$P_0^{ - \gamma }$ with γ≈1.2$\gamma \approx 1.2$, revealing a crossover from spontaneous ...
M. Alejandro Justo‐Guerrero +5 more
wiley +1 more source

