Results 71 to 80 of about 2,422,228 (271)
Coarsening‐Resistant Ag Sinter Composites: Mechanistic Insights From Different Ag–Additive Systems
Advanced Electronic Materials, EarlyView.An Ag–WC sintered composite exhibiting superior resistance to thermal coarsening. Different particle‐reinforced Ag sinter composites showed markedly different microstructural responses to thermal aging. The comparison revealed that robust Ag–additive interfaces maintain grain‐boundary pinning, whereas insufficient interfacial stability results in the ...
Yang Liu +4 more
wiley +1 more source
Implicit integration scheme for porous viscoplastic potential-based constitutive equations [PDF]
, 2011 This paper deals with a viscoplastic potential-based model allowing thermomechanical damage behavior modeling of porous materials. The model describes rate dependent effects, hardening, creep as well as defects coalescence and propagation.
Msolli, S. +11 more
core +1 more source
RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT
Jixie qiangdu, 2022 Aiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on ...
CU QiangYi +5 more
doaj
Advanced Intelligent Discovery, EarlyView.This article implements a unified human digital twin framework that integrates cutting edge actuation, sensing, simulation, and bidirectional feedback capability. The approach includes integrating multimodal sensing, AI, and biomechanical simulation into one compact system.
Tajbeed Ahmed Chowdhury +4 more
wiley +1 more source
, 2020 In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based composite solders at 260 °C for different times.
Huan He +6 more
semanticscholar +1 more source
Advanced Intelligent Systems, EarlyView.A hybrid mobile robot with a modular Variable‐Stiffness Bridge transitions between a rigid locomotion platform and a flexible, shape‐conforming body. By enclosing objects within its deformable structure rather than relying on dedicated end effectors, the robot achieves orientation‐regulated planar transport, with conformal contact quality shown to ...
Luiza Labazanova +5 more
wiley +1 more source
Bonding through novel solder-metallic mesh composite design
Materials & Design, 2018 Thin metallic Cu and Ni meshes were successfully embedded within SAC305 solder joints. Defects (residues) within the joint were removed by a vacuum step in the bonding sequence.
Adrian Lis +5 more
doaj +1 more source
Microelectronics and reliability, 2019 Lead-free tin-based solder joints often have a single-grained structure with random orientation and highly anisotropic properties. These alloys are typically stiffer than lead-based solders, hence transfer more stress to printed circuit boards (PCBs ...
S. Akbari +4 more
semanticscholar +1 more source
Thermally Drawn Bioelectric Catheters: Enabling Proprioceptive Endovascular Navigation
Advanced Intelligent Systems, EarlyView.This work introduces a novel bioelectric navigation system eliminates the need for harmful fluoroscopy during endovascular surgeries. A bespoke 16‐electrode catheter is fabricated using rapid thermal drawing and laser micro‐machining. Paired with a real‐time tracking algorithm fusing vascular geometry detection and distance estimation, this technology ...
Alex Ranne +8 more
wiley +1 more source
Hanjie xuebaoHigh reliability application fields often require specialized devices, which have slower iteration updates and higher costs. COTS devices have a fast update speed and good quality consistency, but their applicability and reliability in specialized fields
Geng LI +5 more
doaj +1 more source