Results 71 to 80 of about 7,263 (261)

A Periosteum‐Inspired Janus Piezoelectric Scaffold Using Bioenergetic‐Driven H‐Type Vascularization for Diabetic Bone Regeneration

Advanced Science, EarlyView.
A periosteum‐inspired Janus piezoelectric scaffold converts micromechanical forces into electrical signals and synergizes with controlled resveratrol release. This dual action reprograms endothelial metabolism, drives H‑type vessel formation, and restores bone–vessel coupling in diabetic bone defects.
Kai Wang, Kai Jiang
wiley   +1 more source

Microstructural and mechanical properties of Sn58Bi/Sn3.0Ag0.5Cu hybrid solder joints containing TiC nanoparticle additions

Journal of Materials Research and Technology
Sn–Bi-based solders have attracted considerable attention as promising materials for use in low-temperature soldering processes due to their low melting point of 139 °C and their excellent wettability.
Kwan-Soo Lim, Jeong-Won Yoon
doaj   +1 more source

An Electrically Conducting Water‐based Reversible Adhesive

Advanced Electronic Materials, EarlyView.
A water‐based reversible glue is demonstrated. The glue has electrical properties similar to other conducting adhesives but can detach after an alkaline wash. Metal fillers are added to an aqueous mixture of polymer nanoparticles synthesized by emulsion polymerization. The nanoparticles are stabilized by poly(acrylic acid) chains bonded to them. The pH‐
Bassam A. Aljohani, Ama B. Asiedu‐Asante, Adriana Sierra‐Romero, Katarina Novakovic, Volker Pickert, Mark Geoghegan   +5 more
wiley   +1 more source

Analysis of surface mount technology solder joints

, 1996
This thesis was submitted for the degree of Doctor of Philosophy and awarded by Brunel University.The factors determining the quality of surface mount technology (SMT) solder joints are numerous, and complex.
Hui, Ip Kee, Hui, I.K.
core  

Interfacial reaction at Cu-core heterogenous solder joints and its effects on mechanical properties during isothermal aging

Hanjie xuebao
Ni/Cu-core + Solder/Cu heterogenous Cu-core solder joints (Ni-Cu Cu-core joints) were subjected to aging experiments at 100 ℃ for 0 h, 48 h, 120 h, and 360 h, respectively. The microstructure evolution of interfacial intermetallic compound (IMC), tensile
Zongxiang YAO, Yikai LIU, Yang ZHOU, Gang WANG, Limeng YIN, Hongju LI, Jiao CAI   +6 more
doaj   +1 more source

Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study

Journal of Materials Research and Technology
In this paper, novel application possibilities of CuO nanoparticles were investigated in SAC0307 solder alloy for composite soldering purposes. CuO nanoparticles in 0.25 and 0.5 wt% were mixed into the solder paste to produce composite solder joints ...
Balázs Illés, Halim Choi, Krzysztof Szostak, Jaeduk Byun, Agata Skwarek   +4 more
doaj   +1 more source

Voids in Solder Joints

Journal of Surface Mount Technology, 2006
ABSTRACT Recently, voids in solder joints has been a hot topic of discussion within the electronics manufacturing industry. The main interest stems from the impact that these voids have on the long term reliability of solder joints. But, not all solder joints voids are the same.
openaire   +1 more source

Self‐Adhesive Conductive Elastomers for Gel‐Free Biopotential Recording

Advanced Electronic Materials, EarlyView.
σPOMaC, a self‐adhesive conductive citrate elastomer incorporating PEDOT:PSS and DBSA, enables gel‐free biopotential electrodes with stable conductivity and intrinsic skin adhesion. The composite exhibits low resistivity (∼ 0.02 Ω·cm), robust electrical performance during repeated use, and reliable on‐body ECG acquisition comparable to Ag/AgCl ...
Kirstie M. K. Queener, Alec Brewer, He Sun, Jack Twiddy, Vladimir A. Pozdin, Koji Sode, Alper Bozkurt, Michael Daniele   +7 more
wiley   +1 more source

Effect of Added Ni Nanoparticles on the Microstructure and Mechanical Properties of Sn58Bi/Cu Solder Joints under Thermal Shock Conditions

Advanced Electronic Materials
Comprehensive properties of Sn58Bi/Cu and Sn58Bi‐0.6Ni/Cu solder joints were systematically investigated after 200, 400, 600, 800, 1000, and 1200 thermal shock cycles ranging from 218 K to 398 K.
Jiamin Zhang, Liang Zhang, Yuhao Chen, Weimin Long, Yunxin Liu   +4 more
doaj   +1 more source

Reliability of Ni-modified reduced graphene oxide reinforced Sn-58Bi/Cu solder joints after isothermal aging

Materials & Design
The Joule heat generated during the opreation of microelectronic devices can subject the Sn-Bi solder alloy to isothermal aging, which affects the reliability of solder joint interconnections. In this study, the effect of nickel-modified reduced graphene
Wenchao Yang, Zhipeng Yang, Liying Luo, Weiou Qin, Shimin Li, Liangwei Li, Zongwu Wei, Yongzhong Zhan   +7 more
doaj   +1 more source