Results 61 to 70 of about 2,422,228 (271)
Advanced Science, EarlyView.This review presents the research advances of adaptive conductive systems from the perspective of materials, circuits, systems, and applications. Deformable conductors consist of substrates/matrices and conductive materials, structural design of circuit interconnections, fabrication of circuit interconnections, as well as intelligent systems ...
Yufei Lu +7 more
wiley +1 more source
Correlation Between Pin Misalignment and Crack Length in THT Solder Joints
Archives of Metallurgy and Materials, 2017 In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys.
Molnar A., Benke M., Gacsi Z.
doaj +1 more source
Materials Research Express, 2019 This paper deals with the effects of electric current on the thermomechanical lifetime of solder joint as the most vulnerable part in electronic packages. The main focus of this paper is located on the Sn3.8Ag-0.5Cu based solder.
Y. Jiao +4 more
semanticscholar +1 more source
Advanced Science, EarlyView.Extrusion‐based 3D printing of silicones and discrete electronic components are combined to create cortical implants for rodents that integrate thermal neuromodulation and electrical recording. Linked to an autonomous auxiliary driver unit, the system enables rapid, stable and localized hypothermia alongside ECoG recording.
Spencer Ryan Moore +6 more
wiley +1 more source
Frontiers in MaterialsThe shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 μm, and 100 μm) with increasing current density (from 6.0 × 103 to 1.1 × 104 A/cm2 ...
Bo Wang +5 more
doaj +1 more source
Scientific Reports, 2019 A lead-free Sn-2.5Ag-0.7Cu base solder with different weight percentages of bismuth (0, 1, 2.5, 5) was used. Thermal properties, microstructure, wettability and mechanical properties were investigated.
R. Sayyadi, H. Naffakh-Moosavy
semanticscholar +1 more source
Advanced Science, EarlyView.A conductive TPU/liquid‐metal nanofibrous film is fabricated via ultrasonic dispersion, electrospinning, and mold imprinting. The film is breathable, stretchable, deformation‐stable, and provides electromagnetic shielding. n‐Butanol encapsulation mitigates liquid‐metal surface tension and improves biocompatibility. Stable ECG, EOG, EEG, and EMG signals
Cong Huang +7 more
wiley +1 more source
, 2015 The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper.
Nath, Jyotishman +3 more
core +1 more source
Thermo-mechanical reliability studies of lead-free solder interconnects [PDF]
, 2021 Solder interconnections, also known as solder joints, are the weakest link in electronics packaging. Reliability of these miniature joints is of utmost interest - especially in safety-critical applications in the automotive, medical, aerospace, power ...
Depiver, Joshua Adeniyi
core
Advanced Electronic Materials, EarlyView.Composite‐based flexible electronics integrate biodegradable polymers, conductive networks, and multilayer device architectures to balance electrical performance, mechanical durability, and controlled degradation. Interfacial engineering and encapsulation regulate transport stability and operational lifetime, while programmed disassembly enables ...
Sayam, Sangho Cho
wiley +1 more source