Results 61 to 70 of about 7,263 (261)
A novel near‐infrared‐II fluorescent imaging capsule endoscope that detects specific fluorescence signals above 900 nm enables highly sensitive, targeted imaging of gastrointestinal cancer tissue. This wirelessly powered and magnetically controlled “smart pill” achieves high sensitivity and deep tissue penetration, allowing precise, non‐invasive ...
Weicheng Wang +10 more
wiley +1 more source
Grain features of SnAgCu solder and their effect on mechanical behaviour of micro-joints [PDF]
SnAgCu alloy, which promises compatible properties with Sn-Pb solder, has been identified as one of the most potential Lead-free solders for electronic interconnections. However, due to the miniaturization of solder joints, a micro-joint of this material
Changqing Liu (1249713) +3 more
core
Electrohydraulic Folding Ring Actuators for Radially Contracting Applications
This work presents an Electrohydraulic Folding Ring Actuator that combines high‐performance electrohydraulic actuation with origami‐inspired folding geometry to achieve constricting radial actuation. This integration yields significant inner lumen constriction, alongside a gripping force capable of holding objects exceeding four times the actuator's ...
Gavril Yong En Tan +4 more
wiley +1 more source
RESEARCH ON THERMAL FATIGUE LIFE OF SOLDER JOINTS FOR AIRBORNE ELECTRONIC EQUIPMENT
Aiming at the problem of thermal fatigue of solder joints for airborne electronic equipment, the evaluation method of thermal fatigue life of solder joints suitable for engineering application was studied, considered that the empirical equation based on ...
CU QiangYi +5 more
doaj
A Supramolecular Reversible and Anisotropic Conductive Adhesive for Flexible Electronics
Supramolecular network‐based nanocomposites are developed as a stretchable conductive adhesive for flexible electronics. It's as convenient as traditional solders and constructs anisotropic conductive and robust stretchable connections among diverse soft/rigid materials.
Tongtong Li +8 more
wiley +1 more source
A multifunctional tantalum incorporation strategy enables simultaneous tuning of carrier concentration, mitigation of grain‐boundary scattering, and enhanced phonon scattering in Mg3(Sb,Bi)2. These synergistic effects markedly improve carrier mobility and suppress lattice thermal conductivity, yielding both high material zT and high module conversion ...
Guangmeng You +9 more
wiley +1 more source
On axisymmetric adhesive joints with graded interface stiffness
An improved analytical model is presented for the stress analysis of interface stiffness graded axisymmetric adhesive joints. The governing integro-differential equation of the problem is obtained through a variational method which minimizes the ...
Kumar, S., Scanlan, J.P.
core +1 more source
Cross-interaction of interfacial reactions in Ni (Au/Ni/Cu)-SnAg-Cu solder joints during reflow soldering and thermal aging [PDF]
The coupling effect of interfacial reactions between two pads in Ni-SnAg-Cu and Au/Ni/Cu-SnAg-Cu solder joints was investigated in this paper. After reflow soldering, a large amount of Cu can diffuse across the solder joint to the opposite pad to form ...
Chen, Hongtao +9 more
core +1 more source
High reliability application fields often require specialized devices, which have slower iteration updates and higher costs. COTS devices have a fast update speed and good quality consistency, but their applicability and reliability in specialized fields
Geng LI +5 more
doaj +1 more source
Bonding through novel solder-metallic mesh composite design
Thin metallic Cu and Ni meshes were successfully embedded within SAC305 solder joints. Defects (residues) within the joint were removed by a vacuum step in the bonding sequence.
Adrian Lis +5 more
doaj +1 more source

