Results 41 to 50 of about 2,422,228 (271)
Journal of Materials Research and TechnologyPower electronic devices face harsh radiation environments in deep space exploration. It is significant to study the reliability of solder joints of electronic devices in radiation environments.
Yang Liu +6 more
doaj +1 more source
Advanced Engineering Materials, EarlyView.Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová +6 more
wiley +1 more source
Journal of Materials Research and TechnologyIn this study, 0.3 wt% Ti nanoparticles (Ti NPs) were incorporated into Sn1.0Ag0.5Cu (SAC105) solder, and vacuum thermo-compression soldering was employed to fabricate two distinct solder joints: Cu/SAC105/Cu and Cu/SAC105-0.3Ti/Cu.
Chuanjiang Wu +4 more
doaj +1 more source
Laser‐Induced Graphene from Waste Almond Shells
Advanced Functional Materials, EarlyView.Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova +9 more
wiley +1 more source
Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]
, 2004 Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
core +1 more source
Effect of isothermal aging on microstructure and properties of Cu-Sn IMC solder joints
Hanjie xuebaoCu-Sn IMC solder joints for chip stack interconnects were prepared via transient liquid phase bonding and subsequently subjected to isothermal aging at 150 ℃. The microstructure evolution and mechanical properties of Cu-Sn IMC solder joints modified with
Lei SUN +5 more
doaj +1 more source
Microstructure, shear properties and corrosion resistance of Cu/Cu-In/Cu solder joints
Journal of Advanced Joining Processes, 2022 Transient liquid phase sintering can successfully fabricate reliable high-temperature solder joints at a relatively low joining temperature by forming intermetallic compounds.
Li Liu +7 more
doaj +1 more source
Advanced Healthcare Materials, EarlyView.NeuroVisio SyncPatch integrates skin‐conformal electromyography (EMG) electrodes with camera‐tracked markers to jointly assess muscle activity and three‐dimensional knee kinematics during rehabilitation. Parallel feedback pathways provide real‐time kinematic guidance during movement and post‐trial neuromuscular feedback.
Bohyung Choi +11 more
wiley +1 more source
Quantitative evaluation of voids in lead free solder joints
, 2015 Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections.
Takyi, Gabriel +2 more
core +1 more source
Stretchable Microelectrode Arrays for Electro‐Mechanical Probing of Brain Spheroids
Advanced Healthcare Materials, EarlyView.A multimodal device featuring kirigami‐patterned stretchable microelectrode arrays enables concurrent mechanical actuation and electrophysiological recording of brain spheroids. The platform supports multiple loading regimes and reveals mechanically induced modulation of spontaneous network activity in 3D neural tissue models.
Eleonora Martinelli +17 more
wiley +1 more source