Results 41 to 50 of about 7,263 (261)
, 2015 The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper.
Nath, Jyotishman +3 more
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Effect of isothermal aging on microstructure and properties of Cu-Sn IMC solder joints
Hanjie xuebaoCu-Sn IMC solder joints for chip stack interconnects were prepared via transient liquid phase bonding and subsequently subjected to isothermal aging at 150 ℃. The microstructure evolution and mechanical properties of Cu-Sn IMC solder joints modified with
Lei SUN +5 more
doaj +1 more source
Lead Halide Perovskite Photoelectrocatalysis
Advanced Materials, EarlyView.Lead halide perovskite semiconductors have emerged as highly promising materials for solar fuel and chemical synthesis. This perspective discusses advances made in the rational photoelectrode design to improve solar‐to‐chemical conversion, product scope, and scalability.
Virgil Andrei
wiley +1 more source
Advances in Magnesium‐Based Thermoelectrics: A Critical Review
Advanced Materials, EarlyView.Magnesium‐based thermoelectric materials have emerged as promising candidates for low‐to‐mid‐temperature energy conversion due to their abundance, low cost, and competitive performance. This review summarizes recent advances in Mg3X2, MgAgSb, and Mg2X systems, covering transport mechanisms, fabrication strategies, stability challenges, and device ...
Li‐Min Zhang +5 more
wiley +1 more source
Reliability of SnPbSb/Cu Solder Joint in the High-Temperature Application
Crystals, 2022 With the continuous miniaturization and increase in functionality of the electronic devices used in the aerospace and national defense industries, the requirements for reliability of the solder joints in these devices keep increasing.
Jiachen Xu +4 more
doaj +1 more source
Weaving Intelligence: Thermally Drawn Multimaterial Fibers Toward AI‐Enabled Smart Textiles
Advanced Materials, EarlyView.Thermally drawn multimaterial fibers are rapidly advancing as intelligent structural units for next‐generation smart textiles. Integrating multimaterial architectures with neuromorphic and spiking‐neural‐network principles enables fabrics that can sense, compute, and adapt autonomously.
Vuong Dinh Trung +9 more
wiley +1 more source
Nonlinear analysis of plastic ball grid array solder joints
, 2001 A nonlinear finite element analysis was carried out to investigate the viscoplastic deformation of solder joints in a ball grid array (BGA) package under temperature cycle. The effects of constraint on print circuit board (PCB) and stiffness of substrate
Qin, Qinghua, Mai, Yiu-Wing, Yan, Cheng
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QUALITY CONTROL AUTOMATED LASER-ULTRASONIC METHOD FOR SOLDER JOINTS OF NOZZLES OF CHAMBERS IN LIQUID ROCKET ENGINES [PDF]
Научно-технический вестник информационных технологий, механики и оптики, 2016 The paper deals with the problem of quality control for solder joints of nozzles of chambers in liquid rocket engines (LRE). The nozzle of LRE chamber is a responsible product, operating in conditions of high pressure and temperature gradient, having a ...
D. S. Sergeev +3 more
doaj +1 more source
Advanced Materials Technologies, EarlyView.A self‐healing and electrically conductive liquid metal elastomer enables robust self‐soldering of surface mount devices for soft electronics. Photothermally activated conductive pathways, strong pressure‐sensitive adhesion, and stable package‐integrated contacts provide high conductivity and extreme stretchability.
Su Thiri San +5 more
wiley +1 more source
Effect Of Lead-free Solder And Gold Content On The Shear Strength, Toughness, IMC And Void Formation [TT267. C518 2004 f rb Kejuruteraan] [Microfiche 7715]. [PDF]
, 2004 Study of interaction between lead free solder with gold and the mechanical toughness,shear strength of solder that associated with intermetallic compound IMC and void formation was carried out.
Oo, Cheng Ee
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