Results 51 to 60 of about 7,263 (261)

Microstructural Evolution and Deterioration of Shear Properties of Sn3.0Ag0.5Cu/Cu Solder Joints after Long-Term Storage at Cryogenic Temperatures

Crystals, 2023
In deep space exploration the exploration equipment will inevitably experience the harsh environment of cryogenic temperature. Solder joints belong to the most vulnerable parts of electronic equipment, and the harsh environment of extreme cryogenic ...
Xiaotong Guo, Xinlang Zuo, Hao He, Hui Xiao, Jiahao Liu, Ruyu Tian, Yufeng Liu   +6 more
doaj   +1 more source

Fully 3D‐Printed Wave‐Wound Electromagnetic Motors

Advanced Materials Technologies, EarlyView.
This work presents the first fully 3D‐printed wave‐wound electromagnetic motors, which are created using conductive nanoparticle inks, carbon‐filled nylon polymers, and surface mount components. These motors can achieve a stall torque of 7.62N·mmA−1$7.62 \nobreakspace N{\cdot }mm A^{-1}$ and efficiency of 28.2 %, which approaches the performance of ...
Joseph Schwalbe, Sebastian Mettes, Eduardo Francke, Kenneth W. Allen, Yi Chen Mazumdar   +4 more
wiley   +1 more source

Miniaturized Bidirectional Thermal Stimulation System Integrated With an Electrode Array for Recording Neural Activities

Advanced Science, EarlyView.
This study presents a miniaturized bidirectional thermal stimulation system integrated with an electrode array enabling real‐time, bidirectional modulation and simultaneous recording of neural activity through localized heating and cooling. By monolithic integration of the Peltier element and with a silicon neural probe, the innovative system allows ...
Zoia Naumkina, Kanghwan Kim, Wesley Charles Smith, Keuntae Kim, Shinwoo Lee, Jiwan Woo, Il‐Joo Cho   +6 more
wiley   +1 more source

Creep-Fatigue Behavior of Microelectronic Solder Joints

, 1991
Even at room temperature, solder joints exhibit both creep and fatigue behavior that is strongly dependent on solder joint configuration, the thermal environment, and the solder alloy properties.
L. C. Wen, E. Jetter, R. G. Ross, J. Winslow, G. R. Mon   +4 more
core   +2 more sources

Electron Microscopy of Gold Soldered Joints [PDF]

Journal of Dental Research, 1968
Electron photomicrographs were taken to examine and compare the structure of the properly heated soldered joints with that of the overheated joints. No diffusion of the solder was observed in the former group and considerable diffusion took place in the latter group.
Kamal El-Ebrashi, M., Asgar, Kamal, Bigelow, Wilbur C.   +2 more
openaire   +3 more sources

Wireless, Adaptable and Fully Implantable Battery‐powered Devices for Optical Stimulation of the Spinal Cord in Small Rodents

Advanced Science, EarlyView.
Current technologies for spinal cord optogenetic stimulation rely on external power sources and face reliability constraints in freely behaving animals. Here, a fully implantable, battery‐powered optoelectronic device is introduced, enabling operation in any selected environment with wireless recharging for months‐long stimulation.
Shahriar Shalileh, Adan Moallemi, Elham Mohseni Vadeghani, Samuel Tretjakov, Brianna Tsuyuki, Alexander Golab, Benjamin Rever, Wolfram Tetzlaff, Dena Shahriari   +8 more
wiley   +1 more source

Correlation Between Pin Misalignment and Crack Length in THT Solder Joints

Archives of Metallurgy and Materials, 2017
In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys.
Molnar A., Benke M., Gacsi Z.
doaj   +1 more source

Automatic visual solder joint inspection [PDF]

IEEE Journal on Robotics and Automation, 1985
An approach is described for the automatic inspection of solder joints on printed circuit boards. Common defects are identified in solder joints and a joint is classified as being good or belonging to one of the defective classes. The motivation for this classification is not just the detection of defective joints, but the desire to automatically take ...
Paul J. Besl, Edward J. Delp, Ramesh C. Jain   +2 more
openaire   +1 more source

Electric‐Current‐Induced Phase Transformation in Cu6Sn5 Below Its Equilibrium Transition Temperature

Advanced Science, EarlyView.
Electric current induces a monoclinic‐to‐hexagonal phase transformation in Cu6Sn5 at a measured bulk temperature of ∼120°C, below the equilibrium transition temperature. Ex situ synchrotron x‐ray diffraction, TEM, and matched thermal controls show that current stressing promotes the formation of a retained hexagonal η‐phase post‐stress state not ...
Shih‐kang Lin, Shubhayan Mukherjee, Yu‐chen Liu, Jun Mizuno   +3 more
wiley   +1 more source

Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing

Frontiers in Materials
The shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with different heights (500 μm, 300 μm, and 100 μm) with increasing current density (from 6.0 × 103 to 1.1 × 104 A/cm2 ...
Bo Wang, Wangyun Li, Wangyun Li, Kailin Pan, Wei Huang, Yubing Gong   +5 more
doaj   +1 more source